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Author:

Liu, Z. (Liu, Z..) | Cao, J. (Cao, J..) | Wu, B. (Wu, B..) | He, C. (He, C..)

Indexed by:

Scopus PKU CSCD

Abstract:

To improve the inspection ability, the integrated technology based on electromechanical impedance (EMI) and ultrasonic guided waves techniques was proposed for defect detection and localization in composite plate. Structural health monitoring technology based on EMI technology has the advantages of high local sensitivity, non-model analysis, etc. It has unique advantages in the field of on-line monitoring of new material structures, such as composite structures for aircraft and spacecraft. Ultrasonic guided waves monitoring technology has the advantages of high detection efficiency, wide detection range and fast detection speed. It is particularly suitable for health monitoring of plate-like structures. This integrated technology based on EMI and ultrasonic guided waves techniques combines the advantages of the local high sensitivity of EMI technology and wide detection range of ultrasonic guided waves technology. Results show that local averaged value imaging method and data fusion algorithm can be used for data processing and fusion of structural health monitoring of composite plate. The location and imaging of the defects in the whole composite plate are achieved. © 2018, Editorial Department of Journal of Beijing University of Technology. All right reserved.

Keyword:

Data fusion; Defect imaging; Electromechanical impedance; Structural health monitoring; Ultrasonic guided waves

Author Community:

  • [ 1 ] [Liu, Z.]College of Mechanical Engineering and Applied Electronics Technology, Beijing University of Technology, Beijing, 100124, China
  • [ 2 ] [Cao, J.]College of Mechanical Engineering and Applied Electronics Technology, Beijing University of Technology, Beijing, 100124, China
  • [ 3 ] [Wu, B.]College of Mechanical Engineering and Applied Electronics Technology, Beijing University of Technology, Beijing, 100124, China
  • [ 4 ] [He, C.]College of Mechanical Engineering and Applied Electronics Technology, Beijing University of Technology, Beijing, 100124, China

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Source :

Journal of Beijing University of Technology

ISSN: 0254-0037

Year: 2018

Issue: 5

Volume: 44

Page: 699-707

Cited Count:

WoS CC Cited Count: 0

SCOPUS Cited Count: 3

ESI Highly Cited Papers on the List: 0 Unfold All

WanFang Cited Count:

Chinese Cited Count:

30 Days PV: 2

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