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Author:

Sun, Dawei (Sun, Dawei.) | Chong, Yong Bing (Chong, Yong Bing.) | Chen, Ke (Chen, Ke.) | Yang, Jinglei (Yang, Jinglei.)

Indexed by:

EI Scopus SCIE

Abstract:

A new approach was developed to load 4,4'-bis-methylene cyclohexane diisocyanate in microcapsules, with outstanding stability in thermal and chemical environments, and excellent efficiency for both self-healing and self-lubricating uses. Well-dispersed microcapsules with diameter of 80 +/- 22 mu m and shell thickness of 3.8 +/- 0.2 mu m were produced with a core fraction of 74 +/- 1.3 wt% as determined by titration. In thermal environments, the microcapsules started to lose 5% mass at 230 degrees C, which was higher than the boiling point of pure HMDI and thermal decomposition temperature of shell material. In chemical environments (hexane, xylene, ethyl acetate and water), the impermeable microcapsules reserved more than 90% of original core material after 20 days immersion. More interestingly, final microcapsules survived successfully in acetone losing only 25% of core material after 24 h. Parameters including microcapsules size, concentrations, immersion durations and solvent polarity were investigated systematically to obtain the stability of microcapsules in organic solvents. The smart coatings (10 wt% microcapsules) showed outstanding self-healing anticorrosion efficiency in sodium chloride solutions, and their friction coefficient decreased by 80% than control samples.

Keyword:

Water resistance Microcapsules Self-lubricating Double-layered shell Organic solvents resistance Self-healing

Author Community:

  • [ 1 ] [Sun, Dawei]Hong Kong Univ Sci & Technol, Dept Mech & Aerosp Engn, Hong Kong, Peoples R China
  • [ 2 ] [Yang, Jinglei]Hong Kong Univ Sci & Technol, Dept Mech & Aerosp Engn, Hong Kong, Peoples R China
  • [ 3 ] [Sun, Dawei]Beijing Univ Technol, Coll Mat Sci & Engn, Beijing 100124, Peoples R China
  • [ 4 ] [Chong, Yong Bing]Nanyang Technol Univ, Sch Mech & Aerosp Engn, Singapore, Singapore
  • [ 5 ] [Chen, Ke]Nanyang Technol Univ, Sch Mech & Aerosp Engn, Singapore, Singapore

Reprint Author's Address:

  • [Yang, Jinglei]Hong Kong Univ Sci & Technol, Dept Mech & Aerosp Engn, Hong Kong, Peoples R China

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Source :

CHEMICAL ENGINEERING JOURNAL

ISSN: 1385-8947

Year: 2018

Volume: 346

Page: 289-297

1 5 . 1 0 0

JCR@2022

ESI Discipline: ENGINEERING;

ESI HC Threshold:156

JCR Journal Grade:1

Cited Count:

WoS CC Cited Count: 114

SCOPUS Cited Count: 121

ESI Highly Cited Papers on the List: 0 Unfold All

WanFang Cited Count:

Chinese Cited Count:

30 Days PV: 5

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