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Abstract：
Thermal stress due to the thermal mismatch in power IC packaging will affect the long-term reliability of a power IC. This paper studied the thermal stress analysis method and a way to reduce the stress in an IC chip. Numerical distribution values of thermal stress in chip packaging and the optimal parameter design method to reduce chip thermal stress were also provided in this paper. © 2001 IEEE.
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2001 6th International Conference on Solid-State and Integrated Circuit Technology, ICSICT 2001 - Proceedings
Year： 2001
Volume： 1
Page： 109-112
Language： English
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WoS CC Cited Count： 0
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ESI Highly Cited Papers on the List： 0 Unfold All
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30 Days PV： 0
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