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Author:

Ji, Y. (Ji, Y..) | Zhong, T.-X. (Zhong, T.-X..) | Gao, X.-X. (Gao, X.-X..) | Shi, N. (Shi, N..) | Cui, Y. (Cui, Y..)

Indexed by:

Scopus PKU CSCD

Abstract:

Interfacial features and interfacial thermal conductivity of three kinds of metal matrix composites (MMC) have been comparatively studied by the scanning thermal probing with the micro-sized special resolution. The statistical method was used to process and translate topographic and thermal voltage data of scamming thermal microscopy (SThM). The data of interfacial width and interfacial thermal conductivity were obtained. The results reveal that the macro thermal conductivity of the MMC can be critically dependent on the reinforcing-matrix interfacial thermal conductivity-.

Keyword:

Interfacial thermal conductivity; Metal matrix composites (MMC); Scanning thermal microscope (SThM)

Author Community:

  • [ 1 ] [Ji, Y.]School of Materials, Beijing Polytechnic University, Beijing 100022, China
  • [ 2 ] [Zhong, T.-X.]School of Materials, Beijing Polytechnic University, Beijing 100022, China
  • [ 3 ] [Gao, X.-X.]School of Materials, Beijing Polytechnic University, Beijing 100022, China
  • [ 4 ] [Shi, N.]School of Materials, Beijing Polytechnic University, Beijing 100022, China
  • [ 5 ] [Cui, Y.]Beijing Institute of Aeronautical Materials, Beijing 100095, China

Reprint Author's Address:

  • [Ji, Y.]School of Materials, Beijing Polytechnic University, Beijing 100022, China

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Source :

Journal of Materials Engineering

ISSN: 1001-4381

Year: 2000

Issue: 12

Page: 29-31,41

Cited Count:

WoS CC Cited Count: 0

SCOPUS Cited Count:

ESI Highly Cited Papers on the List: 0 Unfold All

WanFang Cited Count:

Chinese Cited Count:

30 Days PV: 8

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