Electron　backscattered　diffraction　was　employed　to　observe　the　orientations　of　as-solidified　Sn3.0Ag3.0Bi3.0In　(SABI333)　joints.　Unlike　other　Sn-based　solder　joints　consisting　of　only　one　grain　or　of　tricrystals,　the　SABI333　joints　typically　consisted　of　polycrystals.　The　polycrystals　were　found　to　originate　from　Sn　grains　with　deflections　(＞　15A　degrees)　from　the　[110]　and　[]　directions,　i.e.,　the　directions　in　which　nucleation　tends　to　occur,　and　the　Bi　and　In　atoms　dissolved　in　the　SnAg　melt　significantly　enhanced　the　deflection.　In　addition,　the　orientations　of　the　SABI333　solder　joints　were　highly　related　to　the　solidification　temperature.　Higher　solidification　temperatures　were　associated　with　higher　degrees　of　deviation.　Additionally,　two　types　of　double　tricrystals　of　Sn　formed　during　solder　joint　solidification　in　the　SABI333　joints.　Although　the　characteristics　of　the　twinning　differed,　both　types　had　80A　degrees-90A　degrees　misorientations.　One　system　featured　four　orientations　of　Sn　grain　twinning　with　a　[100]　or　[010]　axis,　while　the　other　one　featured　perpendicular　tricrystals.