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Author:

Ding, W.-L. (Ding, W.-L..) | Liu, X.-M. (Liu, X.-M..) (Scholars:刘小明) | Fu, S.-F. (Fu, S.-F..) | Wang, W.-F. (Wang, W.-F..)

Indexed by:

Scopus PKU CSCD

Abstract:

Background IR simulation for three-dimensional ground is very important for infrared simulation. A new method for complex three-dimensional simulation of the background infrared radiation was proposed based on digital elevation model. First, the infrared radiation characteristic equation of arbitrary inclined surface was established; Then the infrared radiation material index images were generated based on image segmentation technology, and the terrain surface temperature distribution was simulated according to the variation of terrain; Finally, three-dimensional infrared radiation characteristics of the complicated 3D terrain background was simulated with OpenGL. Experimental results show that this method effectively improves the detail and realism of the background infrared radiation characteristics.

Keyword:

Digital elevation model; Image processing; Infrared simulation; Virtual reality

Author Community:

  • [ 1 ] [Ding, W.-L.]Institute of Electrical Engineering, Yanshan University, Qinhuangdao 066004, China
  • [ 2 ] [Ding, W.-L.]Key Laboratory of Opto-Electronics Information Processing, Chinese Academy of Sciences, Shenyang 110016, China
  • [ 3 ] [Liu, X.-M.]College of Electronic Information and Control Engineering, Beijing University of Technology, Beijing 100124, China
  • [ 4 ] [Fu, S.-F.]Key Laboratory of Opto-Electronics Information Processing, Chinese Academy of Sciences, Shenyang 110016, China
  • [ 5 ] [Wang, W.-F.]Institute of Electrical Engineering, Yanshan University, Qinhuangdao 066004, China
  • [ 6 ] [Wang, W.-F.]Key Laboratory of Opto-Electronics Information Processing, Chinese Academy of Sciences, Shenyang 110016, China

Reprint Author's Address:

  • [Ding, W.-L.]Institute of Electrical Engineering, Yanshan University, Qinhuangdao 066004, China

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Source :

Journal of System Simulation

ISSN: 1004-731X

Year: 2012

Issue: 12

Volume: 24

Page: 2521-2524,2529

Cited Count:

WoS CC Cited Count: 0

SCOPUS Cited Count:

ESI Highly Cited Papers on the List: 0 Unfold All

WanFang Cited Count:

Chinese Cited Count:

30 Days PV: 5

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