Study on fatigue property for electroplated copper thin film by pulsed laser shock peening - Details

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Abstract：

Electroplated　copper　film　with　double　U　shape　notches　was　treated　by　laser　shock　peening　(LSP).　The　specimen　was　fabricated　with　LIGA　(lithographie,　galvanformung,　abformung)-like　electroplating　technology.　The　changes　of　mechanical　and　fatigue　properties　of　specimens　before　and　after　LSP　were　studied　under　pulsating　cyclic　loading.　The　areas　of　hysteresis　loop　of　different　conditions　at　the　same　cycle　are　compared,　and　it　shows　that　when　the　inner　of　edge　of　specimen　is　peened　by　the　laser　beams,　the　fatigue　capability　of　the　specimen　is　obviously　improved.　The　data　of　experiment　shows　that　it　should　be　causing　more　damage　in　the　specimens　by　non-LSP　then　the　ones　by　LSP.　The　way　of　LSP　can　lessened　damage　of　material,　and　the　fatigue　lives　of　the　specimens　are　also　improved.

Keyword：

Copper thin film; Fatigue life; Hysteresis loop; Laser shock peening (LSP); Micro-electro-mechanical systems (MEMS)

Author Community：

[ 1 ] [Liu, X.]College of Mechanical Engineering and Applied Electronics Technology, Beijing University of Technology, Beijing 100124, China
[ 2 ] [Shang, D.]College of Mechanical Engineering and Applied Electronics Technology, Beijing University of Technology, Beijing 100124, China
[ 3 ] [Liu, H.]College of Mechanical Engineering and Applied Electronics Technology, Beijing University of Technology, Beijing 100124, China
[ 4 ] [Xu, M.]College of Mechanical Engineering and Applied Electronics Technology, Beijing University of Technology, Beijing 100124, China
[ 5 ] [Xu, J.]College of Mechanical Engineering and Applied Electronics Technology, Beijing University of Technology, Beijing 100124, China
[ 6 ] [Liu, T.]College of Mechanical Engineering and Applied Electronics Technology, Beijing University of Technology, Beijing 100124, China

Reprint Author's Address：

[Shang, D.]College of Mechanical Engineering and Applied Electronics Technology, Beijing University of Technology, Beijing 100124, China

Email：

shangdg@bjut.edu.cn

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Source ：

Journal of Mechanical Strength

ISSN： 1001-9669

Year： 2012

Issue： 5

Volume： 34

Page： 751-756

Cited Count：

WoS CC Cited Count：

SCOPUS Cited Count：

ESI Highly Cited Papers on the List： 0 Unfold All

WanFang Cited Count：

Chinese Cited Count：

30 Days PV： 14

Affiliated Colleges：

材料科学与工程学院本学院/部未明确归属的数据

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