• Complex
  • Title
  • Keyword
  • Abstract
  • Scholars
  • Journal
  • ISSN
  • Conference
搜索

Author:

Jia, Yuting (Jia, Yuting.) | Xia, Guodong (Xia, Guodong.) (Scholars:夏国栋) | Li, Yifan (Li, Yifan.) | Ma, Dandan (Ma, Dandan.) | Cai, Bo (Cai, Bo.)

Indexed by:

EI Scopus SCIE

Abstract:

This paper constructs a three-dimensional model to numerically investigate the heat transfer and fluid flow characteristics of combined microchannel with cone-shaped micro pin fins (MCPF) for inlet Re number ranging from 147 to 637. Firstly, the cases of micro pin fins located in the upstream (case1), middle (case2), downstream (case3) of microchannel and distributed throughout the microchannel (case4) are studied with fixed number of fins. Thereafter, the dimensionless parameters of relative fin diameter, relative space between the fins and relative height of the fin are studied to optimize the design. The variations of apparent friction factor f(app),(ave) and average Nusselt number Nu(ave) with inlet Re number have been conducted, and the thermal enhancement factor (eta) has been adopted as evaluation criteria to determine the best comprehensive thermal-hydraulic performance of MCPF. The results show that the microchannel inserted cone-shaped micro pin fins improves the heat transfer accompanied with a higher pressure drop as compared with the smooth rectangular (Rec) microchannel. Microchannel with uniform fins distribution (case4) has the largest eta and the bottom wall temperature is the lowest and well-distributed among all cases. When Re < 500, the overall thermal performance of case3 is better than case1 but when Re > 500, it displays a contrary tendency. The geometric configuration optimization of MCPF suggests that there is an optimum pin diameter, fin space and fin height that satisfy the demands of heat transfer and pressure drop.

Keyword:

Microchannel Heat transfer enhancement Fluid flow Numerical simulation Cone-shaped micro pin fin

Author Community:

  • [ 1 ] [Jia, Yuting]Beijing Univ Technol, Key Lab Enhanced Heat Thsnsfer & Energy Conservat, Minist Educ, Coll Environm & Energy Engn, Beijing 100124, Peoples R China
  • [ 2 ] [Xia, Guodong]Beijing Univ Technol, Key Lab Enhanced Heat Thsnsfer & Energy Conservat, Minist Educ, Coll Environm & Energy Engn, Beijing 100124, Peoples R China
  • [ 3 ] [Li, Yifan]Beijing Univ Technol, Key Lab Enhanced Heat Thsnsfer & Energy Conservat, Minist Educ, Coll Environm & Energy Engn, Beijing 100124, Peoples R China
  • [ 4 ] [Ma, Dandan]Beijing Univ Technol, Key Lab Enhanced Heat Thsnsfer & Energy Conservat, Minist Educ, Coll Environm & Energy Engn, Beijing 100124, Peoples R China
  • [ 5 ] [Cai, Bo]Beijing Univ Technol, Key Lab Enhanced Heat Thsnsfer & Energy Conservat, Minist Educ, Coll Environm & Energy Engn, Beijing 100124, Peoples R China

Reprint Author's Address:

  • 夏国栋

    [Xia, Guodong]Beijing Univ Technol, Key Lab Enhanced Heat Thsnsfer & Energy Conservat, Minist Educ, Coll Environm & Energy Engn, Beijing 100124, Peoples R China

Show more details

Related Keywords:

Source :

INTERNATIONAL COMMUNICATIONS IN HEAT AND MASS TRANSFER

ISSN: 0735-1933

Year: 2018

Volume: 92

Page: 78-89

7 . 0 0 0

JCR@2022

ESI Discipline: ENGINEERING;

ESI HC Threshold:156

JCR Journal Grade:1

Cited Count:

WoS CC Cited Count: 87

SCOPUS Cited Count: 83

ESI Highly Cited Papers on the List: 0 Unfold All

WanFang Cited Count:

Chinese Cited Count:

30 Days PV: 10

Online/Total:513/10598939
Address:BJUT Library(100 Pingleyuan,Chaoyang District,Beijing 100124, China Post Code:100124) Contact Us:010-67392185
Copyright:BJUT Library Technical Support:Beijing Aegean Software Co., Ltd.