In　surface　mount　technology,　the　Sn-3.0Ag-0.5Cu　solder　joint　has　a　shorter　impact　lifetime　than　a　traditional　lead-tin　solder　joint.　In　order　to　improve　the　impact　property　of　SnAgCu　lead-free　solder　joints　and　identify　the　effect　of　silver　content　on　tensile　strength　and　impact　property,　impact　experiments　were　conducted　at　various　strain　rates　on　three　selected　SnAgCu　based　solder　joints.　It　was　found　that　joint　failure　mainly　occurred　in　the　solder　material　with　large　plastic　deformation　under　low　strain　rate,　while　joint　failure　occurred　at　the　brittle　intermetallic　compound　layer　without　any　plastic　deformation　at　a　high　strain　rate.　Joint　strength　increased　with　the　silver　content　in　SnAgCu　alloys　in　static　tensile　tests,　while　the　impact　property　of　the　solder　joint　decreased　with　increasing　silver　content.　When　the　strain　rate　was　low,　plastic　deformation　occurred　with　failure　and　the　tensile　strength　of　the　Sn-3.0Ag-0.5Cu　solder　joint　was　higher　than　that　of　Sn-0.3Ag-0.7Cu;　when　the　strain　rate　was　high,　joint　failure　mainly　occurred　at　the　brittle　interface　layer　and　the　Sn-0.3Ag-0.7Cu　solder　joint　had　a　better　impact　resistance　with　a　thinner　intermetallic　compound　layer.