Interface thermal resistance effect on thermal rectification using bulk materials - Details

Author：

Zhu, Y. (Zhu, Y..) | Wang, J. (Wang, J..) (Scholars：王军) | Luo, S. (Luo, S..) | Xia, G. (Xia, G..)

Indexed by：

Scopus CSCD

Abstract：

Within　the　framework　of　heat　conduction　by　the　Fourier＇s　law,　one　is　able　to　observe　thermal　rectification　phenomenon　in　a　two-segment　bar　with　segments　that　have　different　temperature　dependences.　However,　the　interface　thermal　resistance　between　these　two　segments　has　been　neglected　in　the　previous　studies.　In　the　present　work,　an　interface　thermal　resistance　has　been　introduced　into　the　thermal　rectification　model,　and　its　influence　on　the　thermal　rectification　effect　is　investigated　by　numerical　method.　It　is　found　that　the　thermal　rectification　ratio　could　be　enhanced　by　week　interface　thermal　resistance,　while　high　interface　thermal　resistance　suppresses　the　heat　conduction　and　reduce　the　thermal　rectification　ratio.　©　2016,　Science　Press.　All　right　reserved.

Keyword：

Interface thermal resistance; Thermal conductivity; Thermal rectification

Author Community：

[ 1 ] [Zhu, Y.]Key Laboratory of Enhanced Heat Transfer and Energy Conservation, College of Environmental and Energy Engineering, Beijing University of Technology, Beijing, 100124, China
[ 2 ] [Wang, J.]Key Laboratory of Enhanced Heat Transfer and Energy Conservation, College of Environmental and Energy Engineering, Beijing University of Technology, Beijing, 100124, China
[ 3 ] [Luo, S.]Key Laboratory of Enhanced Heat Transfer and Energy Conservation, College of Environmental and Energy Engineering, Beijing University of Technology, Beijing, 100124, China
[ 4 ] [Wang, J.]Key Laboratory of Enhanced Heat Transfer and Energy Conservation, College of Environmental and Energy Engineering, Beijing University of Technology, Beijing, 100124, China
[ 5 ] [Xia, G.]Key Laboratory of Enhanced Heat Transfer and Energy Conservation, College of Environmental and Energy Engineering, Beijing University of Technology, Beijing, 100124, China

Reprint Author's Address：

王军
[Wang, J.]Key Laboratory of Enhanced Heat Transfer and Energy Conservation, College of Environmental and Energy Engineering, Beijing University of TechnologyChina

Email：

jwang@bjut.edu.cn

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Source ：

Scientia Sinica Technologica

ISSN： 1674-7259

Year： 2016

Issue： 2

Volume： 46

Page： 175-183

Cited Count：

WoS CC Cited Count：

SCOPUS Cited Count： 5

ESI Highly Cited Papers on the List： 0 Unfold All

WanFang Cited Count：

Chinese Cited Count：

30 Days PV： 1

Affiliated Colleges：

化学与生命科学学院本学院/部未明确归属的数据

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