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Author:

Sun Jiantong (Sun Jiantong.) | Li Xiaoyan (Li Xiaoyan.) | Zhang Liang (Zhang Liang.) | Yan Wentao (Yan Wentao.) | Yang Qinzheng (Yang Qinzheng.)

Indexed by:

EI Scopus SCIE PKU CSCD

Abstract:

A new type Al-Zn-Mg-Cu alloy was welded using Tungsten Inert Gas welding method. Microstructures and microhardness of the joint were analyzed. The relationship of the temperature with microstructure and microhardness was established based on the simulation result of the temperature field through the Visual-weld. At last, the residual stress was tested by the X-ray diffraction method. The results show that microstructure in the weld seam is a coarse equiaxed grain zone (EQZ). That zone close to the fusion line is an equiaxed grain zone with small size, which is as called Fine-Grain Layer. For the Fine-Grain layer, microstructure exhibits epitaxial solidification morphology. However, partial grain boundary re-melt appears outside of fusion line. Residual stress in the weldment is small and has almost the same distribution in the stable forming segment of weld seam. However, it has an inverse distribution in the front end of weld seam. With the influence of temperature curve of welding and i phase, microhardness in the hot affected zone is bigger than that in other zones in the weldment.

Keyword:

microtopography residual stress microhardness Al-Zn-Mg-Cu alloy Butt-weld of MIG

Author Community:

  • [ 1 ] [Sun Jiantong]Beijing Univ Technol, Beijing 100124, Peoples R China
  • [ 2 ] [Li Xiaoyan]Beijing Univ Technol, Beijing 100124, Peoples R China
  • [ 3 ] [Zhang Liang]Beijing Univ Technol, Beijing 100124, Peoples R China
  • [ 4 ] [Yan Wentao]Beijing Univ Technol, Beijing 100124, Peoples R China
  • [ 5 ] [Yang Qinzheng]Beijing Univ Technol, Beijing 100124, Peoples R China

Reprint Author's Address:

  • [Sun Jiantong]Beijing Univ Technol, Coll Mat Sci & Engn, Beijing 100124, Peoples R China

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Source :

RARE METAL MATERIALS AND ENGINEERING

ISSN: 1002-185X

Year: 2017

Issue: 9

Volume: 46

Page: 2607-2612

0 . 7 0 0

JCR@2022

ESI Discipline: MATERIALS SCIENCE;

ESI HC Threshold:287

CAS Journal Grade:4

Cited Count:

WoS CC Cited Count: 1

SCOPUS Cited Count:

ESI Highly Cited Papers on the List: 0 Unfold All

WanFang Cited Count:

Chinese Cited Count:

30 Days PV: 5

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