The　ultrafine　copper　powders　were　produced　by　the　ammonia　leaching　and　electrodepositing　method　from　waste　printed　circuit　boards.　The　effects　of　electrodepositing　parameters　such　as　sulfuric　acid　concentration,　current　density,　electrodepositing　time　and　temperature　of　solution　on　the　copper　recovery　were　studied　respectively.　The　results　showed　that　the　ultrafine　copper　powders　with　high　purity　and　dendrite　shape　was　successfully　obtained　under　the　sulfuric　acid　concentration　of　12　g/L,　current　density　of　4　A/dm2,　electrodepositing　time　of　3　h　and　temperature　of　solution　of　40°C.　The　size　of　the　copper　powder　was　between　3　and　6　μm,　and　the　copper　recovery　was　over　97%.