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Author:

Wu, B. (Wu, B..) (Scholars:吴斌) | Zhang, J. (Zhang, J..) | Qiu, Z.-G. (Qiu, Z.-G..) | He, C.-F. (He, C.-F..) (Scholars:何存富)

Indexed by:

Scopus PKU CSCD

Abstract:

According to the ultrasonic propagation characteristics and spring model condition, the relationship between the reflection coefficient of bonding interface and incidence angle under once reflection echo was derived, the influence on the reflective properties of bonding interface with the change of bonding material were studied, and the reflection coefficients of weak bonding interface with different stiffness ratio and incidence angle were calculated. Numerical simulation results show that when oblique incidence wave is S-wave, there is a critical angle, and the reflection coefficient changes greatly under the critical angle; critical angle varies with the changing of the upper material, and the reflection coefficient reaches the minimum under the critical angle; when debonding, with the increase of the critical angle, the minimum reflection coefficient decreases; for the weak bonding interface, with the stiffness ratio decreases, the reflection coefficient drifts upward when the incidence angle is smaller than a certain angle.

Keyword:

Oblique incidence; Reflection coefficient; Spring model; Stiffness ratio

Author Community:

  • [ 1 ] [Wu, B.]College of Mechanical Engineering and Applied Electronics Technology, Beijing University of Technology, Beijing 100124, China
  • [ 2 ] [Zhang, J.]College of Mechanical Engineering and Applied Electronics Technology, Beijing University of Technology, Beijing 100124, China
  • [ 3 ] [Qiu, Z.-G.]College of Mechanical Engineering and Applied Electronics Technology, Beijing University of Technology, Beijing 100124, China
  • [ 4 ] [He, C.-F.]College of Mechanical Engineering and Applied Electronics Technology, Beijing University of Technology, Beijing 100124, China

Reprint Author's Address:

  • 吴斌

    [Wu, B.]College of Mechanical Engineering and Applied Electronics Technology, Beijing University of Technology, Beijing 100124, China

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Source :

Journal of Beijing University of Technology

ISSN: 0254-0037

Year: 2013

Issue: 6

Volume: 39

Page: 801-805,891

Cited Count:

WoS CC Cited Count: 0

SCOPUS Cited Count:

ESI Highly Cited Papers on the List: 0 Unfold All

WanFang Cited Count:

Chinese Cited Count:

30 Days PV: 4

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