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Author:

Ye, X. X. (Ye, X. X..) | Imai, H. (Imai, H..) | Shen, J. H. (Shen, J. H..) | Chen, B. (Chen, B..) | Han, G. Q. (Han, G. Q..) | Umeda, J. (Umeda, J..) | Takahashi, M. (Takahashi, M..) | Kondoh, K. (Kondoh, K..)

Indexed by:

EI Scopus SCIE

Abstract:

Dynamic recrystallization and strengthening-toughening effects were investigated in the processed near- < alpha > Ti-xSi alloy by hot extrusion. The yielding and ultimate tensile strengths were enhanced by 138.5 MPa and 118.7 MPa in the hot-extruded Ti-Si alloy compared with pure Ti. The double GSS effects (gradient silicon solutes - gradient shearing strain) led to the bimodal microstructure (21.8 mu m deformed strips and 5.2 mu m recrystallized grains) and grain refinement by dragging the recrystallization nucleation and grains growth during extrusion. The yielding strength enhancement was resulted from multi-factor Si solid solution, grain refinement and oxygen solid solution. Multi-factor Si solid solution was found to be the dominant mechanism, which was a summation of size misfit, modulus mismatch, strain hardening, narrow slip band and texture strengthening. Obvious strain hardening and late necking occurrence would be positive in obtaining the excellent ultimate tensile strength. Ductility was maintained at 22.9% from strain compatibility and cracks suppression. This study may provide a new understanding on the relationship among the mechanical properties, microstructure and processing of Ti-xSi alloy.

Keyword:

Grain refinement Titanium alloy Strengthening mechanism Dynamic recrystallization

Author Community:

  • [ 1 ] [Ye, X. X.]Osaka Univ, JWRI, Suita, Osaka 565, Japan
  • [ 2 ] [Imai, H.]Osaka Univ, JWRI, Suita, Osaka 565, Japan
  • [ 3 ] [Shen, J. H.]Osaka Univ, JWRI, Suita, Osaka 565, Japan
  • [ 4 ] [Chen, B.]Osaka Univ, JWRI, Suita, Osaka 565, Japan
  • [ 5 ] [Umeda, J.]Osaka Univ, JWRI, Suita, Osaka 565, Japan
  • [ 6 ] [Takahashi, M.]Osaka Univ, JWRI, Suita, Osaka 565, Japan
  • [ 7 ] [Kondoh, K.]Osaka Univ, JWRI, Suita, Osaka 565, Japan
  • [ 8 ] [Han, G. Q.]Beijing Univ Technol, Coll Mat Sci & Engn, Beijing, Peoples R China

Reprint Author's Address:

  • [Ye, X. X.]Osaka Univ, JWRI, Suita, Osaka 565, Japan

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Source :

MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING

ISSN: 0921-5093

Year: 2017

Volume: 684

Page: 165-177

6 . 4 0 0

JCR@2022

ESI Discipline: MATERIALS SCIENCE;

ESI HC Threshold:287

CAS Journal Grade:2

Cited Count:

WoS CC Cited Count: 25

SCOPUS Cited Count: 26

ESI Highly Cited Papers on the List: 0 Unfold All

WanFang Cited Count:

Chinese Cited Count:

30 Days PV: 5

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