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Abstract：
W-Ni-Cu compound materials were obtained by a fused-salt electrolysis method and an aqueous solution electrolysis method. W-Ni-Cu functionally graded materials (FGM) characterized with different thickness (25, 35 and 45 µm) were obtained from the compound materials after annealing at 800 °C for 60, 120 and 180 min, respectively, and Ni plays a role in bridging Cu and W. Cracks and abscission are not present in the surface of samples after thermal shock and thermal fatigue, which indicates the material has good bonding properties. Thermal conductivity tests were also conducted, and the result shows that the thermal conductivity of pure W plate and W-Ni-Cu FGM decrease with increasing temperature (25~800 °C). The thermal conductivity of pure W plate is higher than that of W-Ni-Cu FGM at the same temperature. The thermal conductivity of W-Ni-Cu FGM decreases with increasing gradient thickness. © 2017, Northwest Institute for Nonferrous Metal Research. Published by Elsevier BV. All rights reserved.
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Rare Metal Materials and Engineering
ISSN： 1002-185X
Year： 2017
Issue： 12
Volume： 46
Page： 3893-3896
0 . 7 0 0
JCR@2022
ESI Discipline： MATERIALS SCIENCE;
ESI HC Threshold：287
CAS Journal Grade：4
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ESI Highly Cited Papers on the List： 0 Unfold All
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30 Days PV： 5
