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学者姓名：季凌飞
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Abstract ：
Significance Hard and brittle materials possess excellent mechanical, optical, and chemical properties. However, the demand for efficient and high-precision processing drives continuous innovation in modern processing technologies. Laser processing plays an increasingly important role in high-precision cutting and shaping of these materials due to its high flexibility, precision, and non-contact nature. In this study, we overview the current research and progress on the key technologies of laser high-precision cutting and shaping of hard and brittle materials, particularly focusing on applications involving large thickness/large length ratio, multi-dimensional components, and composite cutting and forming. In addition, we discuss the challenges and prospects of this technology, aiming to provide theoretical guidance and a technical foundation for the advancement of related industries. Progress We first discuss the fundamental interaction between lasers and brittle materials. We elaborate on the laser processing of large thickness brittle materials, high-precision cutting of multi-dimensional components, and composite cutting and forming technologies. Besides, we analyze the technical principles, advantages, and application examples of these technologies, which lays a solid foundation for innovations in laser cutting of hard and brittle materials. For the laser cutting of materials with large thickness or a high length-to-diameter ratio, methods such as non-destructive close piercing, multi-focal distribution spherical aberration correction, Bessel beam modulation, and laser filamentation have been successfully applied to address issues like heat accumulation, beam aberration, and energy loss. These methods enable high-precision cutting of thick, hard, and brittle materials, including the machining of complex structures that are challenging for traditional methods. In multi-dimensional structure cutting, the application of computer numerical control (CNC) technology enables precise multi-dimensional laser cutting and structuring. The closed-loop feedback system, with high-precision positioning and trajectory control, plays a crucial role in achieving accurate multi-dimensional cutting and forming. Laser composite cutting and forming technologies significantly improve cutting accuracy and quality by integrating laser techniques with other processing methods. Coupling laser processing with mechanical methods, liquid assistance, chemical etching, and optical far-field-induced near-field breakdown (O-FIB) effectively reduces thermal damage, microcracks, and recast layers. These composite methods not only increase processing efficiency but also expand the range of applications for hard and brittle materials, enabling more intricate multi-dimensional structures. The progress of laser high-precision cutting methods enhances the machining accuracy and efficiency of hard and brittle materials, broadening their application prospects in fields such as precision instruments, artificial intelligence, and bioengineering. With continuous advancements, laser cutting and shaping technologies will play a more significant role in future micro/nano- manufacturing. Conclusions and Prospects Laser cutting technology is widely used in industrial manufacturing due to its ability to enhance machining accuracy and efficiency while minimizing thermal effects. We systematically review recent advances in laser high-precision cutting and shaping of hard and brittle materials. By integrating cutting-edge techniques such as chemical etching, multiphoton absorption, and liquid-assisted methods, laser cutting effectively mitigates issues like thermal stress and microcracking. Particularly for complex structures and large-thickness materials, innovative approaches such as Bessel beams, multi-focus technology, and far-field-induced near-field enhancement further improve cutting performance and precision. As new materials, including composites and functional materials, emerge, laser cutting technology continues to expand in its applications. Further exploration of the interaction between lasers and various materials, as well as optimization of processes tailored to new material requirements, is necessary. The deep integration of laser technology with intelligent manufacturing and automation will provide a powerful momentum for the future development of high-end equipment.
Keyword ：
laser cutting laser cutting hard and brittle materials hard and brittle materials high precision machining high precision machining
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| GB/T 7714 | Ji, Lingfei , Zhang, Sen , Lin, Zhenyuan et al. Key Technology and Application of Laser High⁃Precision Cutting and Shaping of Hard and Brittle Materials (Invited) [J]. | ACTA OPTICA SINICA , 2025 , 45 (2) . |
| MLA | Ji, Lingfei et al. "Key Technology and Application of Laser High⁃Precision Cutting and Shaping of Hard and Brittle Materials (Invited)" . | ACTA OPTICA SINICA 45 . 2 (2025) . |
| APA | Ji, Lingfei , Zhang, Sen , Lin, Zhenyuan , Fan, Jinshuai , Zhang, Wenlong , Yao, Tianran et al. Key Technology and Application of Laser High⁃Precision Cutting and Shaping of Hard and Brittle Materials (Invited) . | ACTA OPTICA SINICA , 2025 , 45 (2) . |
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Abstract ：
通过飞秒激光单脉冲实验，探究了偏振方向（0°、45°、90°、135°）对x-切铌酸锂（LN）晶体损伤阈值的影响，发现材料损伤阈值呈现明显的偏振依赖性，90°偏振方向的损伤阈值低于其他偏振方向。通过第一性原理计算，确认了飞秒激光引起的隧穿电离主要导致Nb—O键断裂。而当入射偏振角度为90°时，易导致更多的Nb—O键断裂，在该偏振方向上的损伤阈值降低。该研究有助于更深入地理解超快激光在LN晶体表面的烧蚀过程，对LN晶体表面功能性器件激光制备有重要的参考价值。
Keyword ：
第一性原理 第一性原理 损伤阈值 损伤阈值 偏振 偏振 铌酸锂 铌酸锂 飞秒激光 飞秒激光
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| GB/T 7714 | 温亚楠 , 林真源 , 季凌飞 . 偏振方向对x-切铌酸锂损伤阈值影响规律（特邀） [J]. | 激光与光电子学进展 , 2024 , 61 (11) : 154-159 . |
| MLA | 温亚楠 et al. "偏振方向对x-切铌酸锂损伤阈值影响规律（特邀）" . | 激光与光电子学进展 61 . 11 (2024) : 154-159 . |
| APA | 温亚楠 , 林真源 , 季凌飞 . 偏振方向对x-切铌酸锂损伤阈值影响规律（特邀） . | 激光与光电子学进展 , 2024 , 61 (11) , 154-159 . |
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Abstract ：
Objective Epoxy removal is an important step when testing the performance of electronic components, and laser ablation is expected to be an ideal method for the efficient and non-destructive removal of epoxy resin because of its precision and control. This study reports the results of the systematic investigation of the influence of a 532 nm laser on the ablation of epoxy resin under different laser parameters using a response surface methodology. A multi-response surface model that considers the effects of the laser fluence, scanning speed, and scanning spacing on the removal rate and roughness during the laser ablation of epoxy resin is established using the central composite design method. The effects of single and multiple factors on the laser ablation of epoxy resin are analyzed. The results indicate that the optimal ranges for the laser fluence, scanning speed, and scanning spacing are 11.20?11.28 J/cm(2), 224?240 mm/s, and 1.50?1.55 mu m, respectively, which result in a removal rate of 1620?1628 mu m(3)/s and roughness range of 5.7?5.8 mu m. The optimal parameters are the laser fluence of 11.20 J/cm(2), scanning speed of 234 mm/s, and scanning spacing of 1.50 mu m. The study results confirm that optimized ceramic components inside electronic devices have lower surface damage, based on a comparative analysis of the micro-morphology, elastic modulus, and element content results of epoxy resin samples before and after parameter optimization. These results have significant value and meaning for the non-destructive testing of electronic components through accurate and efficient epoxy resin ablation. Methods A nanosecond laser with a wavelength of 532 nm, pulse width of 6 ns, and repetition frequency of 100 Hz is used to perform ablation tests on epoxy resin-coated electronic devices. Taking the laser fluence, scanning speed, and scanning spacing as input factors, and the roughness and removal rate as output responses, a mathematical?physical regression model of the removal rate and roughness with the above laser parameters is established using three-factor five-level full-response central composite design experiments. In addition, the process parameters needed to obtain the optimal removal effect are obtained, with the reliability of the model proven through validation experiments. The microscopic morphology of the samples after the removal of the epoxy resin is observed and analyzed using scanning electron microscope (SEM). The roughness and removal rate of the samples are measured and calculated using laser confocal microscope, and the elasticity modulus of the electronic device surface after removing the epoxy resin is measured using atomic force microscope (AFM). The parameter combination of smaller laser fluence (11.20?11.40 J/cm(2)), faster scanning speed (200?240 mm/s), and appropriate scanning spacing (approximately 1.50 mu m) allows the laser to ablate the epoxy resin in a more moderate way, which results in a smaller roughness (Fig. 4). The average elastivity modulus of the electronic device surface after the removal of the epoxy resin is (318.0 +/- 10.5)GPa, and after optimizing the parameters, the laser ablation does no damage to the mechanical properties (Fig. 6). Results and Discussions The calculation results show that the optimum removal rate during the laser ablation is obtained with a laser fluence of 11.60?11.80 J/cm(2), scanning speed of 160?180 mm/s, and scanning spacing of 1.50?2.00 mu m (Fig. 3). In this case, increasing the laser fluence increases the energy absorption rate of the epoxy resin, and decreasing the scanning speed increases the interaction time between the laser and material. In addition, decreasing the scanning spacing increases the overlap rate of the spot between rows and the energy of the laser irradiation per unit area. As shown by the SEM images, the surface of the laser-removed epoxy resin sample is relatively clean and tidy after the optimization of the parameters (Fig. 5). The elasticity modulus measured via AFM is (318.0 +/- 10.5)GPa, which demonstrates the low laser-induced damage to an electronic component during the removal of epoxy resin. Conclusions A mathematical-physical model of the laser ablation of epoxy resin is established by adopting the response surface method, and the effects of the process parameters and their interaction on the removal rate and roughness during the laser ablation of epoxy resin are systematically investigated. This leads to the optimum theoretical laser parameters for obtaining the maximum removal rate and minimum roughness. The calculation results show that the optimized removal rate and roughness during laser ablation are obtained at a laser fluence range of 11.20?11.28 J/cm(2), scanning speed range of 224?240 mm/s, and scanning spacing range of 1.50?1.55 mu m. The obtained removal rate has a range of 1620?1628 mu m(3)/s, and the roughness has a range of 5.7?5.8 mu m. The optimal combination of parameters includes a laser fluence of 11.20 J/cm(2), scanning speed of 234 mm/s, and scanning spacing of 1.50 mu m. The morphologies and mechanical properties of the removed epoxy resin samples before and after process optimization also confirm the feasibility of the method. These study results have important research value and significance for the efficient removal of epoxy resin via laser ablation and the development of nondestructive testing methods for electronic components.
Keyword ：
central composite design central composite design response surface methodology response surface methodology epoxy resin epoxy resin laser technique laser technique non-destructive ablation non-destructive ablation
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| GB/T 7714 | Wang, Guanqiang , Lin, Zhenyuan , Sun, Weigao et al. Optimization of Laser Ablation Process of Epoxy Resin by Response Surface Methodology [J]. | CHINESE JOURNAL OF LASERS-ZHONGGUO JIGUANG , 2024 , 51 (24) . |
| MLA | Wang, Guanqiang et al. "Optimization of Laser Ablation Process of Epoxy Resin by Response Surface Methodology" . | CHINESE JOURNAL OF LASERS-ZHONGGUO JIGUANG 51 . 24 (2024) . |
| APA | Wang, Guanqiang , Lin, Zhenyuan , Sun, Weigao , Ji, Lingfei . Optimization of Laser Ablation Process of Epoxy Resin by Response Surface Methodology . | CHINESE JOURNAL OF LASERS-ZHONGGUO JIGUANG , 2024 , 51 (24) . |
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Abstract ：
Ultrafast laser lift-off is an important step in manufacturing flexible electronic display devices. To improve the picosecond laser lift-off transfer quality of micro light emitting diodes (micro-LEDs), the response surface methodology (RSM) is employed for the optimization of multiple laser processing parameters, including laser power, scanning speed, spot diameter, and scanning distance. Transfer yield and residual stress are chosen as the performance evaluation metrics, as well as the lifted-off device element composition and transfer quality under different process parameters are characterized. The optimized maximum transfer yield is 95.84% and the minimum residual tensile stress is 0.589 GPa, which is less than 0.5% prediction error of the optimum transfer yield (95.67-95.74%) and residual stress (0.588-0.592 GPa) for ultrafast laser lift-off of micro-LEDs based on the central composite design of RSM, indicating the reliable guidance ability of this model. It develops a new way for quality improvement of the ultrafast laser lift-off process for micro-LEDs.
Keyword ：
micro-LED micro-LED Ultrafast laser Ultrafast laser laser transfer laser transfer response surface methodology response surface methodology
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| GB/T 7714 | Sun, Weigao , Wang, Guanqiang , Ji, Lingfei et al. Response surface methodology assisted optimization of ultrafast laser lift-off micro-LEDs [J]. | MATERIALS AND MANUFACTURING PROCESSES , 2024 . |
| MLA | Sun, Weigao et al. "Response surface methodology assisted optimization of ultrafast laser lift-off micro-LEDs" . | MATERIALS AND MANUFACTURING PROCESSES (2024) . |
| APA | Sun, Weigao , Wang, Guanqiang , Ji, Lingfei , Lin, Zhenyuan . Response surface methodology assisted optimization of ultrafast laser lift-off micro-LEDs . | MATERIALS AND MANUFACTURING PROCESSES , 2024 . |
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Objective Lithium niobate crystals with deep microhole structures are excellent photonic-crystal devices with modulation properties of wavelength selection. However, current fabrication methods, such as focused ion beam etching, chemical etching, or conventional laser drilling, remain a considerable challenge for obtaining microholes with high-aspect-ratios in lithium niobate crystals. This paper presents a strategy for the one-step fabrication of uniform deep microhole arrays with a 700???1 aspect ratio within lithium niobate crystals using the ultrafast laser temporal Bessel shaping technique. This efficient and high-quality strategy for fabricating deep microhole arrays has excellent process stability. The prepared lithium niobate microhole array has remarkable selective beam transmittance, and we hope that this strategy can be used as a promising method for fabricating lithium niobate photonic-crystals. Methods In this study, the original femtosecond Gaussian beam was transformed into a zero-order Bessel beam using a series of beam shaping units and the energy distribution of the femtosecond Bessel beam was calculated via COMSOL simulations. The one-step fabrication of deep microholes was realized using the high peak power of the femtosecond laser and by adjusting the spatial energy distribution of the Bessel beam. By matching the pulse frequency and the speed of the moving stage, stable and uniform fabrication of large-area deep microhole arrays could be achieved by varying beam energy and the relative focal position. The resulting microhole morphology and aspect ratio were evaluated using scanning electron microscope, confocal laser scanning microscope, and optical microscope. Additionally, the beam transmission test was performed on the microhole arrays, verifying the structure's excellent selective beam transmission ability. Results and Discussions The femtosecond Bessel beam obtained after beam shaping successfully realized the fabrication of microhole arrays with a 700???1 aspect ratio. Varying the laser power can effectively adjust the morphology and aspect ratio of the fabricated microhole. With an increase in laser power, the diameter and depth of the microhole become larger but the aspect ratio gradually decreases. At the same time, an increase in laser power can lead to a side lobe etching effect on the sample surface, resulting in degradation of the device performance or even its damage. Variation in the relative focal position slightly changes the microhole diameter but considerably affects the depth of the microhole. Furthermore, maximum utilization of the Bessel beam energy can be achieved when the Bessel beam is focused at the center of the sample, and a complete through-hole of a 500 mu m thick lithium niobate crystal is realized. This high-aspect-ratio microhole array demonstrates excellent selective transmission of light beams in the 450510 nm range. Conclusions In this study, a femtosecond Bessel beam is successfully used to rapidly produce a uniform array of microholes with an aspect ratio of 700???1 inside a lithium niobate crystal. The effects of laser output power and relative focal position on the microhole's morphology, depth, and aspect ratio are systematically studied and summarized. The laser power range for inhibiting the side lobe etching effect and the design principles of the microhole array are presented. The high-aspect-ratio lithium niobate photonic-crystal filter is fabricated based on the optimization of the processing parameters, and the wavelength-selective transmission of the structure for beams in the range of 450510 nm is demonstrated through the transmission spectrum measurements. The efficient and reliable processing of high-aspect-ratio microhole structures provides a new pathway that is worth exploring for the fabrication of lithium-niobate-based photonic-crystal devices.
Keyword ：
laser technique laser technique aspect ratio aspect ratio ultrafast lasers ultrafast lasers lithium niobate lithium niobate Bessel beam Bessel beam photonic-crystal photonic-crystal
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| GB/T 7714 | Sun Weigao , Ji Lingfei , Zheng Jincan et al. High-Aspect-Ratio Photonic-Crystal Structure of Lithium Niobate Fabricated via Femtosecond Bessel Beam Direct Writing [J]. | CHINESE JOURNAL OF LASERS-ZHONGGUO JIGUANG , 2022 , 49 (10) . |
| MLA | Sun Weigao et al. "High-Aspect-Ratio Photonic-Crystal Structure of Lithium Niobate Fabricated via Femtosecond Bessel Beam Direct Writing" . | CHINESE JOURNAL OF LASERS-ZHONGGUO JIGUANG 49 . 10 (2022) . |
| APA | Sun Weigao , Ji Lingfei , Zheng Jincan , Wen Yanan , Wang Guanqiang . High-Aspect-Ratio Photonic-Crystal Structure of Lithium Niobate Fabricated via Femtosecond Bessel Beam Direct Writing . | CHINESE JOURNAL OF LASERS-ZHONGGUO JIGUANG , 2022 , 49 (10) . |
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Abstract ：
Characteristics and formation mechanism of filamentary plasma string induced by single picosecond laser pulse in sapphire are studied experimentally and numerically. Relative brightness and spatial distribution of the filamentary plasma string are characterized by time-resolved luminescence images. The whole filamentary plasma string is composed of a leading plasma string with stronger brightness and a tailing plasma string with weaker brightness. The numerical analysis shows that the different characteristics of filamentary plasma string are related to the two types of spatiotemporal evolution stages. The pivotal role of avalanche ionization for different spatiotemporal evolution stages is revealed. The filamentary plasma string induced by single pulse has a guiding significance for the subsequent pulse nonlinear propagation and the material modification; all the above provides basic information for the multi-pulse filamentation and the laser-induced filamentation processing of sapphire.
Keyword ：
Nonlinear ionization Nonlinear ionization Picosecond laser Picosecond laser Spatiotemporal evolution Spatiotemporal evolution Filamentary plasma string Filamentary plasma string Sapphire Sapphire
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| GB/T 7714 | Yan, Tianyang , Ji, Lingfei , Sun, Weigao . Characteristics and formation mechanism of filamentary plasma string induced by single picosecond laser pulse in sapphire [J]. | APPLIED PHYSICS A-MATERIALS SCIENCE & PROCESSING , 2022 , 128 (1) . |
| MLA | Yan, Tianyang et al. "Characteristics and formation mechanism of filamentary plasma string induced by single picosecond laser pulse in sapphire" . | APPLIED PHYSICS A-MATERIALS SCIENCE & PROCESSING 128 . 1 (2022) . |
| APA | Yan, Tianyang , Ji, Lingfei , Sun, Weigao . Characteristics and formation mechanism of filamentary plasma string induced by single picosecond laser pulse in sapphire . | APPLIED PHYSICS A-MATERIALS SCIENCE & PROCESSING , 2022 , 128 (1) . |
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Abstract ：
Laser-induced backside wet etching is a promising technology to process sapphire substrate. However, the conventional working media including toxic organic and heavy metal salt solutions is not environmentally friendly. In this paper, the backside wet etching of sapphire substrate with ink as a working solution by laser induced carbothermal reduction is achieved. Raman and XRD analyses demonstrate that ink can provide a stable carbon source and the carbothermal reduction of sapphire occurs during the etching. Numerical calculation reveals that the deposition of the carbon layer plays a crucial role in heating the sapphire to the temperature triggering the carbothermal reduction. The grooves etched by the laser-induced carbothermal reduction have smooth walls and good shape reproducibility. The linearly increase in etching depth with pulse number at the same laser fluence. The high-quality etching based on the carbothermal reduction as the etching mechanism is beneficial for fabricating microstructures on sapphire.
Keyword ：
Carbon deposition Carbon deposition Backside wet etching Backside wet etching Carbothermal reduction Carbothermal reduction Sapphire Sapphire
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| GB/T 7714 | Yan, Tianyang , Ji, Lingfei , Hong, Minghui . Backside wet etching of sapphire substrate by laser-induced carbothermal reduction [J]. | OPTICS AND LASER TECHNOLOGY , 2022 , 149 . |
| MLA | Yan, Tianyang et al. "Backside wet etching of sapphire substrate by laser-induced carbothermal reduction" . | OPTICS AND LASER TECHNOLOGY 149 (2022) . |
| APA | Yan, Tianyang , Ji, Lingfei , Hong, Minghui . Backside wet etching of sapphire substrate by laser-induced carbothermal reduction . | OPTICS AND LASER TECHNOLOGY , 2022 , 149 . |
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Abstract ：
Scanning silicon surface with a picosecond laser with pulse width of 10 ps, frequency of 200 kHz and wavelength of 1064 nm will self-form microhole structure. By changing pulse energy density, scanning speed and scanning times, the evolution law of microhole is studied experimentally. The results show that the influence of different parameters on microholes can he summarized as pulse energy density and effective pulse number per unit area. With the increase of pulse energy density, the microholes gradually move to both sides of the groove, from the initial random arrangement to the one-dimensional linear uniform arrangement. With the increase of effective pulse number per unit area, the number of microholes on both sides of the edge changes from less to more, and the size changes from small to large, and finally microholes disappear. By simulating the temperature field, the change of phase transition and surface tension of materials at different temperatures was analyzed. It was found that liquid silicon solidified under the drive of surface tension to form protrusions, which led to uneven deposition of laser energy and finally formed microholes. This indicates that the physical mechanism of microhole self-forming is the combined action of laser-induced material phase transformation and Marangoni effect.
Keyword ：
microhole structure microhole structure laser optics laser optics silicon silicon picosecond laser scanning picosecond laser scanning self-formation self-formation
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| GB/T 7714 | Li Xin , Zhang Tong , Ji Lingfei et al. Study on Self-Forming Behavior and Mechanism of Silicon Microholes by Picosecond Laser Scanning [J]. | LASER & OPTOELECTRONICS PROGRESS , 2022 , 59 (1) . |
| MLA | Li Xin et al. "Study on Self-Forming Behavior and Mechanism of Silicon Microholes by Picosecond Laser Scanning" . | LASER & OPTOELECTRONICS PROGRESS 59 . 1 (2022) . |
| APA | Li Xin , Zhang Tong , Ji Lingfei , Zhang Litian . Study on Self-Forming Behavior and Mechanism of Silicon Microholes by Picosecond Laser Scanning . | LASER & OPTOELECTRONICS PROGRESS , 2022 , 59 (1) . |
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Abstract ：
<正>激光制造技术，是一种基于激光与物质相互作用的先进制造手段，具有低成本、高精度、高自由度等特点。通过调控加工模式和参数，激光加工可以实现二维或三维跨尺度微纳结构的控型制造或功能材料的控性制备，突破了传统制造方法在空间和时间上的局限性。近年来，激光制造技术逐渐向“设计-制造-器件”一体化方向发展，在物联网、人工智能、医疗器械、航空航天、生物制造等多个前沿科学领域展现出新的应用前景。本专题主要从方法和应用两个方面介绍激光制造技术的现状与发展趋势。
Keyword ：
激光制造技术 激光制造技术 飞秒激光 飞秒激光 微纳制造 微纳制造
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| GB/T 7714 | 徐凯臣 , 季凌飞 , 吴志刚 . 激光制造技术与新应用专题导读 [J]. | 光电工程 , 2022 , 49 (02) : 5-6 . |
| MLA | 徐凯臣 et al. "激光制造技术与新应用专题导读" . | 光电工程 49 . 02 (2022) : 5-6 . |
| APA | 徐凯臣 , 季凌飞 , 吴志刚 . 激光制造技术与新应用专题导读 . | 光电工程 , 2022 , 49 (02) , 5-6 . |
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The influence of the picosecond (ps) pulsed burst with a nanosecond scale of temporal separation (50 ns) on filamentary traces in sapphire substrate is investigated. The spatiotemporal evolution of the filamentary plasma string induced by sub-pulses of the burst-mode is revealed according to the analysis of the instantaneous photoluminescence images. Due to the presence of residual plasma, the energy loss of sub-pulse during the balancing of self-focusing effect is reduced, and thus refreshes the plasma via refocusing. The refreshed plasma peak generated by the subsequent subpulse appears at relatively low density positions in the formed filamentary plasma string, which results in more uniform densities and less spatial overlap among the plasma peaks. The continuity and uniformity of the filamentary trace in sapphire are enhanced by the burst-mode. Besides, the burst filamentary propagation can also remain effective when the sub-pulse energy is below the self-focusing threshold. Based on this uniform and precise energy propagation mode, the feasibility of its use for the laser lift-off (LLO) process is verified.
Keyword ：
laser lift-off laser lift-off picosecond laser picosecond laser spatiotemporal evolution spatiotemporal evolution burst-mode burst-mode filamentary plasma string filamentary plasma string
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| GB/T 7714 | Sun Wei-gao , Yan Tian-yang , Wang Yu-heng et al. Spatiotemporal evolution of high-aspect-ratio filamentary trace in sapphire of picosecond pulse burst-mode for laser lift-off [J]. | JOURNAL OF CENTRAL SOUTH UNIVERSITY , 2022 , 29 (10) : 3304-3311 . |
| MLA | Sun Wei-gao et al. "Spatiotemporal evolution of high-aspect-ratio filamentary trace in sapphire of picosecond pulse burst-mode for laser lift-off" . | JOURNAL OF CENTRAL SOUTH UNIVERSITY 29 . 10 (2022) : 3304-3311 . |
| APA | Sun Wei-gao , Yan Tian-yang , Wang Yu-heng , Ji Ling-fei . Spatiotemporal evolution of high-aspect-ratio filamentary trace in sapphire of picosecond pulse burst-mode for laser lift-off . | JOURNAL OF CENTRAL SOUTH UNIVERSITY , 2022 , 29 (10) , 3304-3311 . |
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