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学者姓名：郭福
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Abstract ：
The accelerated application research of power electronic devices intensively stimulates the interconnect materials to catch the ability of low-temperature sintering and high-temperature service. Herein, the uniform micro/nano-hybrid structure particles, which are Ag nanoparticles decorated on the surface of Cu microparticles (Cu MPs@Ag NPs), are fabricated by a mild one-step liquid-phase reduction method. XRD and TG analysis results demonstrate Cu MPs@Ag NPs obtain better anti-oxidation than Cu MPs, which is caused by the decorated Ag NPs. Meanwhile, bare Cu-Cu bonding with Cu MPs@Ag NPs paste is achieved at 200 degrees C, 250 degrees C, and 300 degrees C in the air. The average strength of the Cu-Cu joint reached 29.6 MPa at 300 degree celsius. Additionally, it is found that the fracture mode of the Cu-Cu joint changes from brittle fracture to ductile fracture when the sintering temperatures increase. This work demonstrates the facilely synthesized micro/nano-hybrid structure particles (Cu MPs@Ag NPs) possess the potential application in high-power density electronic packaging.
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| GB/T 7714 | Zhou, Wei , Deng, Wenhao , Ji, Zhihao et al. Bare copper bonding with facilely synthesized Ag nanoparticles decorated Cu microparticles paste [J]. | JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS , 2024 , 35 (24) . |
| MLA | Zhou, Wei et al. "Bare copper bonding with facilely synthesized Ag nanoparticles decorated Cu microparticles paste" . | JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS 35 . 24 (2024) . |
| APA | Zhou, Wei , Deng, Wenhao , Ji, Zhihao , Ji, Xiaoliang , Ma, Liming , Lin, Pengrong et al. Bare copper bonding with facilely synthesized Ag nanoparticles decorated Cu microparticles paste . | JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS , 2024 , 35 (24) . |
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Abstract ：
Ag-Cu nanoparticles, integrating the advantages of Ag and Cu, are promising materials for power electronic packaging. In this work, a novel dual-beam pulsed laser deposition method was proposed to prepare an Ag-Cu nanoparticle film with various component ratios and used for die attach at low temperatures. The as-deposited Ag-Cu nanoparticle film was mainly composed of Ag-Cu solid solution, Ag element, and Cu element, and most of the nanoparticles were in the alloying state. The Ag-Cu sintered joint presented a dense microstructure with 10.8% porosity, and the shear strength of Ag-Cu sintered joints could reach 60 MPa at 250 C-degrees. The sintered joint porosity increased as more Cu were added in the Ag-Cu nanoparticle film, resulting in a decrease in the interfacial connection ratio. The fracture mode of sintered joints gradually changed from the sintered layer to the mixed sintered layer and interface fracture. The dual-beam pulsed laser deposition method could guide in designing the component ratios of bimetallic nanoparticles.
Keyword ：
sintering sintering low-temperature bonding low-temperature bonding power electronic packaging power electronic packaging Ag-Cu nanoparticle film Ag-Cu nanoparticle film dual-beam pulsed laser deposition dual-beam pulsed laser deposition
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| GB/T 7714 | Zhou, Bolong , Jia, Qiang , Wang, Yishu et al. Preparation of Ag-Cu nanoparticle film using a dual-beam pulsed laser deposition for power electronic packaging [J]. | JOURNAL OF LASER APPLICATIONS , 2024 , 36 (2) . |
| MLA | Zhou, Bolong et al. "Preparation of Ag-Cu nanoparticle film using a dual-beam pulsed laser deposition for power electronic packaging" . | JOURNAL OF LASER APPLICATIONS 36 . 2 (2024) . |
| APA | Zhou, Bolong , Jia, Qiang , Wang, Yishu , Li, Dan , Zhang, Hongqiang , Hu, Huan et al. Preparation of Ag-Cu nanoparticle film using a dual-beam pulsed laser deposition for power electronic packaging . | JOURNAL OF LASER APPLICATIONS , 2024 , 36 (2) . |
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Abstract ：
The sintering process of Cu nanoparticles is challenging due to the oxidation of Cu and the formation of voids in the die-attach layer. In this work, a simple and cost-effective bimodal-sized Cu composite paste was prepared for a high-strength Cu-Cu joint. The joint microstructure and sintering properties were systematically investigated by adjusting the mass ratio of the particle dimensions from 80 nm to 300 nm and varying the sintering parameters. Die attachment by pressure (20 MPa)-assisted sintering in air at 250 degrees C was rapidly achieved using bimodal-sized Cu particles. The joint sintered for 1 min exhibited shear strength of 85.63 MPa, while 5-min sintering was able to obtain a dense bondline structure, and the shear strength reached 102.46 MPa. The sintered layers in nitrogen had the highest thermal conductivity of 284 W/m K and low resistivity of 4.42 mu ohm cm. These results confirm that bimodal-sized Cu composite paste can be considered as an inexpensive potential die-attach material for high-temperature electronics packaging.
Keyword ：
sintered Cu joints sintered Cu joints bimodal-sized Cu nanoparticles bimodal-sized Cu nanoparticles sintering mechanism sintering mechanism Power electronic packaging Power electronic packaging
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| GB/T 7714 | Ma, Limin , Lu, Ziyi , Jia, Qiang et al. Sintering Mechanism of Bimodal-Sized Cu Nanoparticle Paste for Power Electronics Packaging [J]. | JOURNAL OF ELECTRONIC MATERIALS , 2024 , 53 (6) : 2988-2998 . |
| MLA | Ma, Limin et al. "Sintering Mechanism of Bimodal-Sized Cu Nanoparticle Paste for Power Electronics Packaging" . | JOURNAL OF ELECTRONIC MATERIALS 53 . 6 (2024) : 2988-2998 . |
| APA | Ma, Limin , Lu, Ziyi , Jia, Qiang , Cui, Ze , Wang, Yishu , Li, Dan et al. Sintering Mechanism of Bimodal-Sized Cu Nanoparticle Paste for Power Electronics Packaging . | JOURNAL OF ELECTRONIC MATERIALS , 2024 , 53 (6) , 2988-2998 . |
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Abstract ：
Sintering of Cu nanoparticles at low temperature is a promising material for advanced power electronic packaging; while its sintering quality is significantly inhibited by oxides. In this work, the Pt-catalyzed formic acid and decomposition of mixtures of organic compounds and copper formate were utilized to eliminate Cu nanoparticles from oxidation to promote Cu atomic diffusion and form strong bonding. The results indicated that the sintered neck length was longer in the Pt-catalyzed formic acid environment, and the stronger atomic diffusion and interparticle bonding was formed. The shear strength of the sintered Cu-Cu joint reached 49 MPa at 180 degrees C. Furthermore, the effects of temperature and pressure on the formation and growth of sintered necks, pore eliminations, densification, and bonding strength were discussed. This work could provide industrial insights from realizing low-temperature sintering used in the field of power electronics.
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| GB/T 7714 | Cui, Ze , Jia, Qiang , Wang, Yishu et al. Enhanced shear strength and microstructure of Cu-Cu interconnection by low-temperature sintering of Cu nanoparticles [J]. | JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS , 2024 , 35 (11) . |
| MLA | Cui, Ze et al. "Enhanced shear strength and microstructure of Cu-Cu interconnection by low-temperature sintering of Cu nanoparticles" . | JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS 35 . 11 (2024) . |
| APA | Cui, Ze , Jia, Qiang , Wang, Yishu , Li, Dan , Wang, Chien-Ping , Zhang, Hongqiang et al. Enhanced shear strength and microstructure of Cu-Cu interconnection by low-temperature sintering of Cu nanoparticles . | JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS , 2024 , 35 (11) . |
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Abstract ：
The rapid development of the third-generation semiconductors has posed new requirements and challenges for power electronic packaging. In recent years, the utilization of nano-Ag and Cu sintering has emerged as a promising solution for third-generation semiconductor packaging. Sintered Ag demonstrates remarkable thermal conductivity and exceptional oxidation resistance, while sintered Cu offers economic benefits and superior electromigration resistance compared to sintered Ag. This work reviews the bonding process of Ag and Cu nanoparticles for power electronics packaging, and the shear strength and reliability of sintered joints. The influence of material properties, encompassing particle size, shape, and composition, along with critical sintering parameters such as temperature, pressure, and duration is discussed. Additionally, the pivotal role played by the metallization layer for the sintered bonding process is evaluated. Various reliability test results are summarized and analyzed focusing on their affecting factors. Furthermore, this review explores the broader landscape by delving into the opportunities and challenges posed by sintered Ag and Cu in the realm of power electronic packaging.
Keyword ：
reliability reliability low-temperature bonding low-temperature bonding nanoparticle sintering nanoparticle sintering Power electronic packaging Power electronic packaging
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| GB/T 7714 | Cui, Ze , Jia, Qiang , Zhang, Hongqiang et al. Review on Shear Strength and Reliability of Nanoparticle Sintered Joints for Power Electronics Packaging [J]. | JOURNAL OF ELECTRONIC MATERIALS , 2024 , 53 (6) : 2703-2726 . |
| MLA | Cui, Ze et al. "Review on Shear Strength and Reliability of Nanoparticle Sintered Joints for Power Electronics Packaging" . | JOURNAL OF ELECTRONIC MATERIALS 53 . 6 (2024) : 2703-2726 . |
| APA | Cui, Ze , Jia, Qiang , Zhang, Hongqiang , Wang, Yishu , Ma, Limin , Zou, Guisheng et al. Review on Shear Strength and Reliability of Nanoparticle Sintered Joints for Power Electronics Packaging . | JOURNAL OF ELECTRONIC MATERIALS , 2024 , 53 (6) , 2703-2726 . |
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Abstract ：
Silver nanoparticle (Ag NP) pastes become a potential die-attachment material with the increased electronic power density. However, the weakness of bonding interface between sintered Ag NPs and bare Cu substrate limits the applications of the Ag NPs paste, thereby reducing the shear strength of the sintered joint. In this work, ultrafast laser processing is utilized to enhance the bonding strength of the sintered Ag joint by fabricating a microstructure interface. The microstructure dimensions are tunable by controlling laser parameters, and then high-strength joints could be obtained. Different substrate microstructures were constructed, and the enhanced bonding mechanism was analyzed by characterizing the cross section and fracture surface morphologies of joints. The ultrafast laser processing could increase the surface energy of Cu substrates to form a more reliable connection with Ag NPs and more energy required for crack extension with the increasing connection area, thereby resulting in a significant improvement in the shear strength of the Ag NP joints. The patterned microstructures on the Cu substrate using this technique showed improved surface energy and increased number of connection areas on the substrate, showing potential for the use in third-generation semiconductors for highly reliable packaging.
Keyword ：
shear strength shear strength surface enhance surface enhance sintering sintering ultrafast laser processing ultrafast laser processing silver nanoparticles silver nanoparticles
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| GB/T 7714 | Ma, Limin , Chen, Yuzhang , Jia, Qiang et al. Construction of microstructures on the Cu substrate using ultrafast laser processing to enhance the bonding strength of sintered Ag nanoparticles [J]. | JOURNAL OF LASER APPLICATIONS , 2024 , 36 (3) . |
| MLA | Ma, Limin et al. "Construction of microstructures on the Cu substrate using ultrafast laser processing to enhance the bonding strength of sintered Ag nanoparticles" . | JOURNAL OF LASER APPLICATIONS 36 . 3 (2024) . |
| APA | Ma, Limin , Chen, Yuzhang , Jia, Qiang , Han, Jing , Wang, Yishu , Li, Dan et al. Construction of microstructures on the Cu substrate using ultrafast laser processing to enhance the bonding strength of sintered Ag nanoparticles . | JOURNAL OF LASER APPLICATIONS , 2024 , 36 (3) . |
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Abstract ：
Today's 3D electronic packaging is characterized by smaller size and higher functional density, which generally require multiple reflow cycles. However, due to the Ostwald ripening process of the interfacial intermetallic compound (IMC), the solder joint's strength would decrease as the number of reflow cycles increases. To address this, we developed a novel composite solder by incorporating nickel-coated carbon fiber (Ni@CF) into the Sn-3.0Ag-0.5Cu (SAC305) solder connection. The study showed that Ni@CF effectively enhanced the stability and reliability of solder joints during multiple reflow processes. Compared with Ni@CF-free equivalents, Ni@CFs promoted the nucleation of interfacial IMC during the solid-liquid reaction and inhibited Ostwald ripening, leading to a refinement of the interfacial IMC grains. As a result, the interface was strengthened, and the shift of shear fracture to the brittle interface seen in the SAC305 solder joint with multiple reflows did not occur in the composite solder joint. Furthermore, carbon fiber strengthened the solder matrix through the load transfer and shear-off mechanisms, depending on its inclination angle with the shear plane. Consequently, the Ni@CFs-reinforced solder joints maintained a shear strength of over 42 MPa throughout ten reflow cycles, while the pristine SAC305 solder joint exhibited decreased shear strength to 33 MPa. This study provides new insights into composite solder joints' stability and reinforcement characteristics when subjected to multiple reflows.
Keyword ：
Carbon fiber Carbon fiber Nickel coating Nickel coating Intermetallic compound grain Intermetallic compound grain Shear strength Shear strength Multiple reflows Multiple reflows
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| GB/T 7714 | Du, Yihui , Ji, Xiaoliang , Lin, Sijia et al. Stable SnAgCu solder joints reinforced by nickel-coated carbon fiber for electronic packaging [J]. | ENGINEERING FRACTURE MECHANICS , 2024 , 307 . |
| MLA | Du, Yihui et al. "Stable SnAgCu solder joints reinforced by nickel-coated carbon fiber for electronic packaging" . | ENGINEERING FRACTURE MECHANICS 307 (2024) . |
| APA | Du, Yihui , Ji, Xiaoliang , Lin, Sijia , Liu, Aiwei , Wang, Yishu , Wu, Yufeng et al. Stable SnAgCu solder joints reinforced by nickel-coated carbon fiber for electronic packaging . | ENGINEERING FRACTURE MECHANICS , 2024 , 307 . |
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Abstract ：
The Cu-Sn full intermetallic compound is a promising high -temperature electronic packaging material, while its preparation is usually time-consuming. In this work, a novel dual -beam laser co -deposition method was proposed to prepare Cu-Sn nanoparticle film for power electronic packaging with high bonding efficiency. Various Cu-Sn contents were prepared to reveal the bonding mechanism of the full intermetallic compound structure. The results show that joints with a Cu content ranging from 20 wt% to 80 wt% could form full intermetallic compounds within 2 min with the shear strength reaching 120 MPa. Specifically, Cu6Sn5, 'island -like' Cu3Sn, and sintered Cu generated successively in the bondline center with the increasing Cu content. All failures occurred within the bondline indicating a higher interface bonding quality, while the 'island -like' Cu3Sn enhanced the shear strength. This die attach process is compatible with current commercial SiC die attach process with lower material cost as well as high efficiency, enabling the Cu-Sn nanoparticle film to be a promising material for highreliability power electronic packaging.
Keyword ：
Pulsed laser deposition Pulsed laser deposition Cu-Sn intermetallic compounds Cu-Sn intermetallic compounds Bonding mechanism Bonding mechanism Power electronic packaging Power electronic packaging
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| GB/T 7714 | Hu, Huan , Jia, Qiang , Wang, Yishu et al. Facile synthesis of Cu-Sn nanoparticle film and its bonding mechanism for power electronic packaging [J]. | JOURNAL OF MATERIALS PROCESSING TECHNOLOGY , 2024 , 329 . |
| MLA | Hu, Huan et al. "Facile synthesis of Cu-Sn nanoparticle film and its bonding mechanism for power electronic packaging" . | JOURNAL OF MATERIALS PROCESSING TECHNOLOGY 329 (2024) . |
| APA | Hu, Huan , Jia, Qiang , Wang, Yishu , Zhou, Bolong , Zhang, Hongqiang , Zhang, Mingan et al. Facile synthesis of Cu-Sn nanoparticle film and its bonding mechanism for power electronic packaging . | JOURNAL OF MATERIALS PROCESSING TECHNOLOGY , 2024 , 329 . |
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Abstract ：
本实用新型公开一种用于烧结银大面积互连接头的电迁移实验装置，包括：导体板、绝缘板以及连接件；导体板的数量为偶数，且导体板不少于两块；两块对应设置的导体板组成为一个实验组，同一实验组内的两块导体板之间设置有用于夹持试验样品的空隙，且两块导体板分别与电源的正极、负极连接；绝缘板安装在导体板的一侧，同一实验组内的两块导体板位于两块绝缘板之间；连接件设置于绝缘板上；连接件用于连接同一实验组内的两块绝缘板，并使两块导体板之间形成电流回路。本实用新型克服了大面积烧结银三明治结构互连接头样品装卡困难的问题，可以对试验样品进行自由更换和拆卸，从而满足了不同规格试样的实验需求，实现接头高效的完成电迁移实验。
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| GB/T 7714 | 郭福 , 吕伊铭 , 汉晶 et al. 一种用于烧结银大面积互连接头的电迁移实验装置 : CN202320446426.4[P]. | 2023-03-10 . |
| MLA | 郭福 et al. "一种用于烧结银大面积互连接头的电迁移实验装置" : CN202320446426.4. | 2023-03-10 . |
| APA | 郭福 , 吕伊铭 , 汉晶 , 马立民 , 晋学轮 , 李腾 et al. 一种用于烧结银大面积互连接头的电迁移实验装置 : CN202320446426.4. | 2023-03-10 . |
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Abstract ：
本实用新型公开一种用于纳米银焊膏热疲劳测试结构，属于功率电子器件封装技术领域，包括基板，基板上方设置有阵列烧结层，阵列烧结层上方设置有芯片，基板与芯片通过阵列烧结层形成互联结构；阵列烧结层由若干个连续设置的纳米银层构成，相邻两纳米银层之间设置有间隙，若干个纳米银层围成正方形结构，且若干个纳米银层沿芯片的边缘设置。本实用新型能够保证互联结构在热疲劳载荷下具有更集中的应力，解决了传统结构在测试热疲劳可靠性高的纳米银焊膏时效果不明显的问题，缩短了测试时间。
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| GB/T 7714 | 马立民 , 陈玉章 , 汉晶 et al. 一种用于纳米银焊膏热疲劳测试结构 : CN202320800760.5[P]. | 2023-04-12 . |
| MLA | 马立民 et al. "一种用于纳米银焊膏热疲劳测试结构" : CN202320800760.5. | 2023-04-12 . |
| APA | 马立民 , 陈玉章 , 汉晶 , 贾强 , 郭福 , 晋学轮 et al. 一种用于纳米银焊膏热疲劳测试结构 : CN202320800760.5. | 2023-04-12 . |
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