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学者姓名：郭福
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Abstract ：
Deformation twinning serves as the primary mechanism of plasticity in body-centered tetragonal tin (Sn), a matrix component of most electronic interconnection materials, as temperature decreases. The formation of intragranular twins and their transmission across grain boundaries significantly influence the deformation behavior and susceptibility to brittle fracture for Sn-based alloys under cryogenic conditions. Here, we performed statistical analysis on a large data set of Sn grains from two commonly used commercial Sn-based solder alloys: Sn-3.0%Ag-0.5%Cu and Sn-3.5%Ag, through uniaxial tensile experiments at cryogenic temperatures and postmortem electron backscattered diffraction characterization. The results indicate that Sn grains with their caxis aligned along the tensile direction exhibit a higher likelihood of twin occurrence. Furthermore, the presence of neighboring grains that have already activated twins also plays a critical role in the generation of new twins. The twin transfer across grain boundaries is contingent upon the geometrical alignment of twin systems in adjacent grains; misalignment can lead to intergranular brittle fracture at cryogenic temperatures.
Keyword ：
Twin transfer Twin transfer Brittle fracture Brittle fracture Cryogenic electronics Cryogenic electronics Sn Sn Deformation twin Deformation twin
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| GB/T 7714 | Wang, Yuxiang , Ji, Xiaoliang , Wang, Yishu et al. Grain orientation and grain neighboring effects on deformation twin of Sn behind the brittle fracture of cryogenic electronics [J]. | MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING , 2025 , 926 . |
| MLA | Wang, Yuxiang et al. "Grain orientation and grain neighboring effects on deformation twin of Sn behind the brittle fracture of cryogenic electronics" . | MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING 926 (2025) . |
| APA | Wang, Yuxiang , Ji, Xiaoliang , Wang, Yishu , Fu, Hanguang , Lin, Jhe-Yu , Guo, Fu . Grain orientation and grain neighboring effects on deformation twin of Sn behind the brittle fracture of cryogenic electronics . | MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING , 2025 , 926 . |
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Abstract ：
A novel Al2O3@TiC@TiB multilayer core-shell ceramic particle was in-situ synthesized in the Fe-based composite coating by laser cladding. The ceramic particle was formed by the addition of trace Al2O3 particles. The core of the multilayer ceramic particle was spherical alpha-Al2O3, the inner shell and outer shell of the particle was TiC and TiB, respectively. The Al2O3@TiC@TiB particle was uniformly distributed in the coating. The hardness and wear rate of the Al2O3-added coatings were 1277.7HV and 0.006 g/h, respectively. Compared with the coatings without the addition of Al2O3, the hardness was improved approximately 32 % and the wear resistance was enhanced by approximately 50 %. This study provides a promising novel multilayer core-shell ceramic particle reinforcement for composite coatings fabricated by laser cladding.
Keyword ：
Mechanical properties Mechanical properties Laser cladding Laser cladding alpha-Al 2 O 3 alpha-Al 2 O 3 Fe-based composite coatings Fe-based composite coatings Multilayer core-shell ceramic particle Multilayer core-shell ceramic particle
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| GB/T 7714 | Ma, Jianping , Li, Lincong , Wang, Zhaohui et al. A novel in-situ Al2O3@TiC@TiB multilayer core-shell ceramic particle reinforced Fe-based composite coating by laser cladding [J]. | MATERIALS LETTERS , 2025 , 388 . |
| MLA | Ma, Jianping et al. "A novel in-situ Al2O3@TiC@TiB multilayer core-shell ceramic particle reinforced Fe-based composite coating by laser cladding" . | MATERIALS LETTERS 388 (2025) . |
| APA | Ma, Jianping , Li, Lincong , Wang, Zhaohui , Yang, Tianwei , Guo, Fu . A novel in-situ Al2O3@TiC@TiB multilayer core-shell ceramic particle reinforced Fe-based composite coating by laser cladding . | MATERIALS LETTERS , 2025 , 388 . |
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Abstract ：
Silver nanoparticle (Ag NP) pastes become a potential die-attachment material with the increased electronic power density. However, the weakness of bonding interface between sintered Ag NPs and bare Cu substrate limits the applications of the Ag NPs paste, thereby reducing the shear strength of the sintered joint. In this work, ultrafast laser processing is utilized to enhance the bonding strength of the sintered Ag joint by fabricating a microstructure interface. The microstructure dimensions are tunable by controlling laser parameters, and then high-strength joints could be obtained. Different substrate microstructures were constructed, and the enhanced bonding mechanism was analyzed by characterizing the cross section and fracture surface morphologies of joints. The ultrafast laser processing could increase the surface energy of Cu substrates to form a more reliable connection with Ag NPs and more energy required for crack extension with the increasing connection area, thereby resulting in a significant improvement in the shear strength of the Ag NP joints. The patterned microstructures on the Cu substrate using this technique showed improved surface energy and increased number of connection areas on the substrate, showing potential for the use in third-generation semiconductors for highly reliable packaging.
Keyword ：
shear strength shear strength surface enhance surface enhance sintering sintering ultrafast laser processing ultrafast laser processing silver nanoparticles silver nanoparticles
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| GB/T 7714 | Ma, Limin , Chen, Yuzhang , Jia, Qiang et al. Construction of microstructures on the Cu substrate using ultrafast laser processing to enhance the bonding strength of sintered Ag nanoparticles [J]. | JOURNAL OF LASER APPLICATIONS , 2024 , 36 (3) . |
| MLA | Ma, Limin et al. "Construction of microstructures on the Cu substrate using ultrafast laser processing to enhance the bonding strength of sintered Ag nanoparticles" . | JOURNAL OF LASER APPLICATIONS 36 . 3 (2024) . |
| APA | Ma, Limin , Chen, Yuzhang , Jia, Qiang , Han, Jing , Wang, Yishu , Li, Dan et al. Construction of microstructures on the Cu substrate using ultrafast laser processing to enhance the bonding strength of sintered Ag nanoparticles . | JOURNAL OF LASER APPLICATIONS , 2024 , 36 (3) . |
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Abstract ：
The accelerated application research of power electronic devices intensively stimulates the interconnect materials to catch the ability of low-temperature sintering and high-temperature service. Herein, the uniform micro/nano-hybrid structure particles, which are Ag nanoparticles decorated on the surface of Cu microparticles (Cu MPs@Ag NPs), are fabricated by a mild one-step liquid-phase reduction method. XRD and TG analysis results demonstrate Cu MPs@Ag NPs obtain better anti-oxidation than Cu MPs, which is caused by the decorated Ag NPs. Meanwhile, bare Cu-Cu bonding with Cu MPs@Ag NPs paste is achieved at 200 degrees C, 250 degrees C, and 300 degrees C in the air. The average strength of the Cu-Cu joint reached 29.6 MPa at 300 degree celsius. Additionally, it is found that the fracture mode of the Cu-Cu joint changes from brittle fracture to ductile fracture when the sintering temperatures increase. This work demonstrates the facilely synthesized micro/nano-hybrid structure particles (Cu MPs@Ag NPs) possess the potential application in high-power density electronic packaging.
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| GB/T 7714 | Zhou, Wei , Deng, Wenhao , Ji, Zhihao et al. Bare copper bonding with facilely synthesized Ag nanoparticles decorated Cu microparticles paste [J]. | JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS , 2024 , 35 (24) . |
| MLA | Zhou, Wei et al. "Bare copper bonding with facilely synthesized Ag nanoparticles decorated Cu microparticles paste" . | JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS 35 . 24 (2024) . |
| APA | Zhou, Wei , Deng, Wenhao , Ji, Zhihao , Ji, Xiaoliang , Ma, Liming , Lin, Pengrong et al. Bare copper bonding with facilely synthesized Ag nanoparticles decorated Cu microparticles paste . | JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS , 2024 , 35 (24) . |
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Abstract ：
Nano-Ag paste is a popular material in power electronic packaging, while its microstructure is unstable at high temperatures and suffers from electrochemical migration. In this work, Ag-Pd nanoalloy film has been prepared by the pulsed laser deposition, and been sintered at low temperature for packaging. The thermal stability is significantly improved at 300 degrees C when Ag is alloyed with Pd. The Pd addition significantly increased the diffusion activation energy of Ag atoms and reduced the diffusion coefficient. The Ag-Pd sintered layer exhibited a stable microstructure at 300 degrees C or even 500 degrees C, which indicated that Ag-Pd nanoalloy had the potential to serve at high temperatures. Ag-Pd nanoalloy will preferentially generate a PdO passivation film and cover the anode surface, thereby slowing down the dissolution of the Ag and improving its resistance to electrochemical migration. This work provides theoretical studies and insights into the applications of Ag-Pd nanoalloys in high-reliability power electronics.
Keyword ：
Power electronic packaging Power electronic packaging Low temperature sintering Low temperature sintering Thermal and electrochemical stability Thermal and electrochemical stability Ag-Pd nanoalloy Ag-Pd nanoalloy
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| GB/T 7714 | Jia, Qiang , Zhou, Bolong , Wang, Yishu et al. Ag-Pd nanoalloy film with ultra-high thermal and electrochemical stability for power electronic packaging [J]. | MATERIALS TODAY COMMUNICATIONS , 2024 , 41 . |
| MLA | Jia, Qiang et al. "Ag-Pd nanoalloy film with ultra-high thermal and electrochemical stability for power electronic packaging" . | MATERIALS TODAY COMMUNICATIONS 41 (2024) . |
| APA | Jia, Qiang , Zhou, Bolong , Wang, Yishu , Zhang, Hongqiang , Li, Dan , Ma, Limin et al. Ag-Pd nanoalloy film with ultra-high thermal and electrochemical stability for power electronic packaging . | MATERIALS TODAY COMMUNICATIONS , 2024 , 41 . |
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Abstract ：
The study explores the possible application of nickel-coated carbon fiber (Ni@CF) to enhance the high-temperature reliability of Sn-3.0Ag-0.5Cu solder connections. It thoroughly examines the growth behavior of intermetallic compounds (IMC) during high-temperature aging. The research results show that after 192 h of aging at 200 degrees C, the overall IMC layer thickness was reduced because of the more tortuous grain boundaries of the interfacial IMC in the Ni@CF composite solder joints. Additionally, the incorporation of Ni@CF led to decreasing disparities in hardness and modulus between the solder matrix and IMC near the joining interface and improved solder matrix and substrate compliance. Enhanced high-temperature hardness of composite solder matrix up to 200 degrees C while maintaining solder joint integrity was observed. The study provides a comprehensive insight into the influence of Ni@CF on interfacial IMC grain structure and the reliability of the composite solder joints in high-temperature environments.
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| GB/T 7714 | Du, Yihui , Ji, Xiaoliang , Liu, Aiwei et al. Evaluating the role of nickel-coated carbon fiber in improving high-temperature capabilities of Sn-3.0Ag-0.5Cu solder joints [J]. | JOURNAL OF MATERIALS SCIENCE , 2024 , 59 (48) : 22250-22265 . |
| MLA | Du, Yihui et al. "Evaluating the role of nickel-coated carbon fiber in improving high-temperature capabilities of Sn-3.0Ag-0.5Cu solder joints" . | JOURNAL OF MATERIALS SCIENCE 59 . 48 (2024) : 22250-22265 . |
| APA | Du, Yihui , Ji, Xiaoliang , Liu, Aiwei , Wang, Yishu , Guo, Fu . Evaluating the role of nickel-coated carbon fiber in improving high-temperature capabilities of Sn-3.0Ag-0.5Cu solder joints . | JOURNAL OF MATERIALS SCIENCE , 2024 , 59 (48) , 22250-22265 . |
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Abstract ：
Today's 3D electronic packaging is characterized by smaller size and higher functional density, which generally require multiple reflow cycles. However, due to the Ostwald ripening process of the interfacial intermetallic compound (IMC), the solder joint's strength would decrease as the number of reflow cycles increases. To address this, we developed a novel composite solder by incorporating nickel-coated carbon fiber (Ni@CF) into the Sn-3.0Ag-0.5Cu (SAC305) solder connection. The study showed that Ni@CF effectively enhanced the stability and reliability of solder joints during multiple reflow processes. Compared with Ni@CF-free equivalents, Ni@CFs promoted the nucleation of interfacial IMC during the solid-liquid reaction and inhibited Ostwald ripening, leading to a refinement of the interfacial IMC grains. As a result, the interface was strengthened, and the shift of shear fracture to the brittle interface seen in the SAC305 solder joint with multiple reflows did not occur in the composite solder joint. Furthermore, carbon fiber strengthened the solder matrix through the load transfer and shear-off mechanisms, depending on its inclination angle with the shear plane. Consequently, the Ni@CFs-reinforced solder joints maintained a shear strength of over 42 MPa throughout ten reflow cycles, while the pristine SAC305 solder joint exhibited decreased shear strength to 33 MPa. This study provides new insights into composite solder joints' stability and reinforcement characteristics when subjected to multiple reflows.
Keyword ：
Carbon fiber Carbon fiber Nickel coating Nickel coating Intermetallic compound grain Intermetallic compound grain Shear strength Shear strength Multiple reflows Multiple reflows
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| GB/T 7714 | Du, Yihui , Ji, Xiaoliang , Lin, Sijia et al. Stable SnAgCu solder joints reinforced by nickel-coated carbon fiber for electronic packaging [J]. | ENGINEERING FRACTURE MECHANICS , 2024 , 307 . |
| MLA | Du, Yihui et al. "Stable SnAgCu solder joints reinforced by nickel-coated carbon fiber for electronic packaging" . | ENGINEERING FRACTURE MECHANICS 307 (2024) . |
| APA | Du, Yihui , Ji, Xiaoliang , Lin, Sijia , Liu, Aiwei , Wang, Yishu , Wu, Yufeng et al. Stable SnAgCu solder joints reinforced by nickel-coated carbon fiber for electronic packaging . | ENGINEERING FRACTURE MECHANICS , 2024 , 307 . |
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Abstract ：
The Cu-Sn full intermetallic compound is a promising high -temperature electronic packaging material, while its preparation is usually time-consuming. In this work, a novel dual -beam laser co -deposition method was proposed to prepare Cu-Sn nanoparticle film for power electronic packaging with high bonding efficiency. Various Cu-Sn contents were prepared to reveal the bonding mechanism of the full intermetallic compound structure. The results show that joints with a Cu content ranging from 20 wt% to 80 wt% could form full intermetallic compounds within 2 min with the shear strength reaching 120 MPa. Specifically, Cu6Sn5, 'island -like' Cu3Sn, and sintered Cu generated successively in the bondline center with the increasing Cu content. All failures occurred within the bondline indicating a higher interface bonding quality, while the 'island -like' Cu3Sn enhanced the shear strength. This die attach process is compatible with current commercial SiC die attach process with lower material cost as well as high efficiency, enabling the Cu-Sn nanoparticle film to be a promising material for highreliability power electronic packaging.
Keyword ：
Pulsed laser deposition Pulsed laser deposition Cu-Sn intermetallic compounds Cu-Sn intermetallic compounds Bonding mechanism Bonding mechanism Power electronic packaging Power electronic packaging
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| GB/T 7714 | Hu, Huan , Jia, Qiang , Wang, Yishu et al. Facile synthesis of Cu-Sn nanoparticle film and its bonding mechanism for power electronic packaging [J]. | JOURNAL OF MATERIALS PROCESSING TECHNOLOGY , 2024 , 329 . |
| MLA | Hu, Huan et al. "Facile synthesis of Cu-Sn nanoparticle film and its bonding mechanism for power electronic packaging" . | JOURNAL OF MATERIALS PROCESSING TECHNOLOGY 329 (2024) . |
| APA | Hu, Huan , Jia, Qiang , Wang, Yishu , Zhou, Bolong , Zhang, Hongqiang , Zhang, Mingan et al. Facile synthesis of Cu-Sn nanoparticle film and its bonding mechanism for power electronic packaging . | JOURNAL OF MATERIALS PROCESSING TECHNOLOGY , 2024 , 329 . |
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Abstract ：
The rapid development of the third-generation semiconductors has posed new requirements and challenges for power electronic packaging. In recent years, the utilization of nano-Ag and Cu sintering has emerged as a promising solution for third-generation semiconductor packaging. Sintered Ag demonstrates remarkable thermal conductivity and exceptional oxidation resistance, while sintered Cu offers economic benefits and superior electromigration resistance compared to sintered Ag. This work reviews the bonding process of Ag and Cu nanoparticles for power electronics packaging, and the shear strength and reliability of sintered joints. The influence of material properties, encompassing particle size, shape, and composition, along with critical sintering parameters such as temperature, pressure, and duration is discussed. Additionally, the pivotal role played by the metallization layer for the sintered bonding process is evaluated. Various reliability test results are summarized and analyzed focusing on their affecting factors. Furthermore, this review explores the broader landscape by delving into the opportunities and challenges posed by sintered Ag and Cu in the realm of power electronic packaging.
Keyword ：
reliability reliability low-temperature bonding low-temperature bonding nanoparticle sintering nanoparticle sintering Power electronic packaging Power electronic packaging
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| GB/T 7714 | Cui, Ze , Jia, Qiang , Zhang, Hongqiang et al. Review on Shear Strength and Reliability of Nanoparticle Sintered Joints for Power Electronics Packaging [J]. | JOURNAL OF ELECTRONIC MATERIALS , 2024 , 53 (6) : 2703-2726 . |
| MLA | Cui, Ze et al. "Review on Shear Strength and Reliability of Nanoparticle Sintered Joints for Power Electronics Packaging" . | JOURNAL OF ELECTRONIC MATERIALS 53 . 6 (2024) : 2703-2726 . |
| APA | Cui, Ze , Jia, Qiang , Zhang, Hongqiang , Wang, Yishu , Ma, Limin , Zou, Guisheng et al. Review on Shear Strength and Reliability of Nanoparticle Sintered Joints for Power Electronics Packaging . | JOURNAL OF ELECTRONIC MATERIALS , 2024 , 53 (6) , 2703-2726 . |
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Abstract ：
The sintering process of Cu nanoparticles is challenging due to the oxidation of Cu and the formation of voids in the die-attach layer. In this work, a simple and cost-effective bimodal-sized Cu composite paste was prepared for a high-strength Cu-Cu joint. The joint microstructure and sintering properties were systematically investigated by adjusting the mass ratio of the particle dimensions from 80 nm to 300 nm and varying the sintering parameters. Die attachment by pressure (20 MPa)-assisted sintering in air at 250 degrees C was rapidly achieved using bimodal-sized Cu particles. The joint sintered for 1 min exhibited shear strength of 85.63 MPa, while 5-min sintering was able to obtain a dense bondline structure, and the shear strength reached 102.46 MPa. The sintered layers in nitrogen had the highest thermal conductivity of 284 W/m K and low resistivity of 4.42 mu ohm cm. These results confirm that bimodal-sized Cu composite paste can be considered as an inexpensive potential die-attach material for high-temperature electronics packaging.
Keyword ：
sintered Cu joints sintered Cu joints bimodal-sized Cu nanoparticles bimodal-sized Cu nanoparticles sintering mechanism sintering mechanism Power electronic packaging Power electronic packaging
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| GB/T 7714 | Ma, Limin , Lu, Ziyi , Jia, Qiang et al. Sintering Mechanism of Bimodal-Sized Cu Nanoparticle Paste for Power Electronics Packaging [J]. | JOURNAL OF ELECTRONIC MATERIALS , 2024 , 53 (6) : 2988-2998 . |
| MLA | Ma, Limin et al. "Sintering Mechanism of Bimodal-Sized Cu Nanoparticle Paste for Power Electronics Packaging" . | JOURNAL OF ELECTRONIC MATERIALS 53 . 6 (2024) : 2988-2998 . |
| APA | Ma, Limin , Lu, Ziyi , Jia, Qiang , Cui, Ze , Wang, Yishu , Li, Dan et al. Sintering Mechanism of Bimodal-Sized Cu Nanoparticle Paste for Power Electronics Packaging . | JOURNAL OF ELECTRONIC MATERIALS , 2024 , 53 (6) , 2988-2998 . |
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