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Author:

Tian, Hui (Tian, Hui.) | Suo, Hongli (Suo, Hongli.) (Scholars:索红莉) | Liang, Yaru (Liang, Yaru.) | Zhao, Yue (Zhao, Yue.) (Scholars:赵艳) | Grivel, Jean-Claude (Grivel, Jean-Claude.)

Indexed by:

EI Scopus SCIE

Abstract:

Two types of Cu-45 at%Ni alloy thin tapes with and without surface shear were obtained by different heavy cold rolling processes. The deformation and recrystallization textures of the two tapes were thoroughly investigated by electron back scattering diffraction technique. The results showed that a shear texture mainly covered the surface of the heavy deformed tapes because of the fraction between the surface of rolling mills and the thin tapes when the rolling force strongly reduced at high strain, which significantly reduced the fraction of rolling texture on the surface of the Cu-45at %Ni alloy thin tapes, retarded the cube grain growth during recrystallization and affected the strong cube texture formation after high temperature annealing. (C) 2014 Published by Elsevier B.V.

Keyword:

Metals and alloys Recrystallization Texture Microstructure

Author Community:

  • [ 1 ] [Tian, Hui]Beijing Univ Technol, Coll Mat Sci & Engn, Beijing 100124, Peoples R China
  • [ 2 ] [Suo, Hongli]Beijing Univ Technol, Coll Mat Sci & Engn, Beijing 100124, Peoples R China
  • [ 3 ] [Liang, Yaru]Beijing Univ Technol, Coll Mat Sci & Engn, Beijing 100124, Peoples R China
  • [ 4 ] [Tian, Hui]Tech Univ Denmark, Dept Energy Convers & Storage, DK-4000 Roskilde, Denmark
  • [ 5 ] [Zhao, Yue]Tech Univ Denmark, Dept Energy Convers & Storage, DK-4000 Roskilde, Denmark
  • [ 6 ] [Grivel, Jean-Claude]Tech Univ Denmark, Dept Energy Convers & Storage, DK-4000 Roskilde, Denmark

Reprint Author's Address:

  • 索红莉

    [Suo, Hongli]Beijing Univ Technol, Coll Mat Sci & Engn, Beijing 100124, Peoples R China

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Source :

MATERIALS LETTERS

ISSN: 0167-577X

Year: 2015

Volume: 141

Page: 83-87

3 . 0 0 0

JCR@2022

ESI Discipline: MATERIALS SCIENCE;

ESI HC Threshold:319

JCR Journal Grade:2

CAS Journal Grade:3

Cited Count:

WoS CC Cited Count: 12

SCOPUS Cited Count: 13

ESI Highly Cited Papers on the List: 0 Unfold All

WanFang Cited Count:

Chinese Cited Count:

30 Days PV: 4

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