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Abstract:
In this paper, a digital method for transient temperature distribution measurement of field programmable gate array (FPGA)-based systems is proposed. The smart thermal sensors used rely on correspondence between the delay and temperature in a ring oscillator. The tested temperature was converted into a time signal with a thermally-sensitive width. The output frequency is read out by a counter with a scan path, and then, transited to PC by a Universal Serial Bus (USB) interface. We capture the infrared images of the FPGA chip by infrared camera. The images were compared with the thermal map of the die constructed using an array of sensors. The tested temperature error varies by less than 1.6 degrees C in the range from 20 degrees C to 90 degrees C, and the maximum sampling rate is 330 Hz. (C) 2014 Elsevier Ltd. All rights reserved.
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MICROELECTRONICS RELIABILITY
ISSN: 0026-2714
Year: 2015
Issue: 2
Volume: 55
Page: 396-401
1 . 6 0 0
JCR@2022
ESI Discipline: ENGINEERING;
ESI HC Threshold:174
JCR Journal Grade:3
CAS Journal Grade:4
Cited Count:
WoS CC Cited Count: 9
SCOPUS Cited Count: 12
ESI Highly Cited Papers on the List: 0 Unfold All
WanFang Cited Count:
Chinese Cited Count:
30 Days PV: 9
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