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Author:

王超 (王超.) (Scholars:王超) | 李晓延 (李晓延.) (Scholars:李晓延) | 朱永鑫 (朱永鑫.)

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CQVIP PKU CSCD

Abstract:

在25 ℃下利用单轴微力疲劳试验机对96.5Sn-3Ag-0.5Cu无铅焊点进行不同驻留时间(1~20 s)和不同应变速率(0.01 ~0.08 mm/s)条件下的低周疲劳试验.结果表明,在25℃下1~20 s的驻留时间对焊点的疲劳寿命影响不大;随着应变速率的加快,焊点的疲劳寿命逐渐降低,断裂机制逐渐由延性断裂向脆性断裂转变.不同应变速率条件下的疲劳裂纹主要在焊点边缘钎料与金属间化合物(IMC)之间的界面处萌生,并在近IMC层的钎料内扩展.焊点断口主要分为:裂纹扩展区和最终断裂区.

Keyword:

驻留时间 应变速率 低周疲劳 无铅焊点 裂纹

Author Community:

  • [ 1 ] [王超]北京工业大学
  • [ 2 ] [李晓延]北京工业大学
  • [ 3 ] [朱永鑫]北京工业大学

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Source :

焊接学报

ISSN: 0253-360X

Year: 2015

Issue: 3

Volume: 36

Page: 71-75

Cited Count:

WoS CC Cited Count: 0

SCOPUS Cited Count:

ESI Highly Cited Papers on the List: 0 Unfold All

WanFang Cited Count: 1

Chinese Cited Count:

30 Days PV: 7

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