TiNi　shape　memory　alloy　(SMA)　and　stainless　steel　(SUS304)　were　joined　by　transient　liquid　phase　(TLP)　diffusion　bonding　using　Ag-Cu　foil　as　interlayer.　The　microstructure,　the　element　profile　and　the　phase　composition　of　the　joint　were　analyzed,　and　the　shear　strength　and　the　fracture　mode　of　the　joint　were　also　investigated.　The　results　show　that　the　interface　zone　of　the　joint　is　composed　of　TiNi　transition　zone,　middle　zone　and　stainless　steel　transition　zone,　and　their　main　phases　are　Ti(Cu,Ni,Fe),　AgCu　and　TiFe,　respectively.　The　maximum　shear　strength　is　about　239　MPa　for　the　specimens　joined　at　860　degrees　C　for　60　min　under　a　specific　pressure　of　0.05　MPa.　The　fracture　occurs　at　the　diffusion　interface　between　TiNi　alloy　and　AgCu　interlayer,　and　the　joint　presents　a　characteristic　of　ductile-brittle　mixed　fracture.　Based　on　interface　morphology　and　element　diffusion　analysis,　the　kinetics　of　isothermal　solidification　was　studied.　It　indicates　that　the　process　of　TLP　diffusion　bonding　of　TiNi　SMA　and　stainless　steel　shows　a　typical　characteristic　of　asymmetry.