• Complex
  • Title
  • Keyword
  • Abstract
  • Scholars
  • Journal
  • ISSN
  • Conference
搜索

Author:

董珂文 (董珂文.) | 林平分 (林平分.)

Abstract:

针对基于ARM9系列的处理器内核的WiMAX终端SoC,构建了一个软硬件协同仿真环境.连接ARM926ejs处理器内核的仿真模型和SoC的RTL模型,利用仿真模型支持的ARM指令集的特性运行WiMAX终端SoC中的MAC层firmware程序,实现了SoC软硬件的同步调试.有效的提高了系统集成和验证的效率,有效地缩短了系统开发时间.

Keyword:

软硬件协同仿真 仿真模型 SoC

Author Community:

  • [ 1 ] [董珂文]北京工业大学
  • [ 2 ] [林平分]北京工业大学

Reprint Author's Address:

Email:

Show more details

Related Keywords:

Source :

电脑知识与技术

ISSN: 1009-3044

Year: 2008

Issue: 1

Volume: 1

Page: 149-152

Cited Count:

WoS CC Cited Count: 0

SCOPUS Cited Count:

ESI Highly Cited Papers on the List: 0 Unfold All

WanFang Cited Count: 1

Chinese Cited Count:

30 Days PV: 10

Affiliated Colleges:

Online/Total:265/10626117
Address:BJUT Library(100 Pingleyuan,Chaoyang District,Beijing 100124, China Post Code:100124) Contact Us:010-67392185
Copyright:BJUT Library Technical Support:Beijing Aegean Software Co., Ltd.