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Author:

Wen, S. P. (Wen, S. P..) | Zong, R. L. (Zong, R. L..) | Zeng, F. (Zeng, F..) | Guo, S. (Guo, S..) | Pan, F. (Pan, F..)

Indexed by:

EI Scopus SCIE

Abstract:

The hardness, elastic modulus and scratch behaviors of Ag/Ni mulitlayers deposited by evaporation have been carried out by nanoindentation and nanoscratch. It has been found that the hardness (H) increases, while the modulus (E) decreases, that is to say an increase of H/E as the periodicity decreases. Many mechanisms are included in nanoscratch, including initial elastic contact, plowing and fracture stage, in each multilayer. Coefficient of friction during plowing decreases with the decrease of the periodicity, which can be ascribed to decreasing material pile-up due to the increase of H/E. Elastic recovery after scratching also increases as the periodicity decreases because of the increase of H/E, which leads to improved wear resistance. The fracture stage will be postponed with decreasing periodicity, which also leads to better wear behavior. (C) 2008 Elsevier B.V. All rights reserved.

Keyword:

Coefficient of friction Nanoindentation H/E Nanoscratch

Author Community:

  • [ 1 ] [Wen, S. P.]Tsinghua Univ, Dept Mat Sci & Engn, Adv Mat Lab, Beijing 100084, Peoples R China
  • [ 2 ] [Zong, R. L.]Tsinghua Univ, Dept Mat Sci & Engn, Adv Mat Lab, Beijing 100084, Peoples R China
  • [ 3 ] [Zeng, F.]Tsinghua Univ, Dept Mat Sci & Engn, Adv Mat Lab, Beijing 100084, Peoples R China
  • [ 4 ] [Guo, S.]Tsinghua Univ, Dept Mat Sci & Engn, Adv Mat Lab, Beijing 100084, Peoples R China
  • [ 5 ] [Pan, F.]Tsinghua Univ, Dept Mat Sci & Engn, Adv Mat Lab, Beijing 100084, Peoples R China
  • [ 6 ] [Wen, S. P.]Beijing Univ Technol, Sch Mat Sci & Engn, Beijing 100022, Peoples R China

Reprint Author's Address:

  • [Pan, F.]Tsinghua Univ, Dept Mat Sci & Engn, Adv Mat Lab, Beijing 100084, Peoples R China

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Source :

APPLIED SURFACE SCIENCE

ISSN: 0169-4332

Year: 2009

Issue: 8

Volume: 255

Page: 4558-4562

6 . 7 0 0

JCR@2022

ESI Discipline: MATERIALS SCIENCE;

JCR Journal Grade:2

CAS Journal Grade:1

Cited Count:

WoS CC Cited Count: 56

SCOPUS Cited Count: 64

ESI Highly Cited Papers on the List: 0 Unfold All

WanFang Cited Count:

Chinese Cited Count:

30 Days PV: 10

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