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Abstract：
In the present paper the effect of trace amount rare earth Y on the microstructure and the performance of Sn3.8Ag0.7Cu solder alloy has been systematically investigated Through measurement of melting temperature, wettability and joint shear strength, and observation of microstructure, it is indicated that the SnAgCuY alloy containing rare earth Y is a lead-free solder with excellent performances. At the same time the best content of Y was deter-mined.
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RARE METAL MATERIALS AND ENGINEERING
ISSN： 1002-185X
Year： 2006
Volume： 35
Page： 121-123
0 . 7 0 0
JCR@2022
ESI Discipline： MATERIALS SCIENCE;
JCR Journal Grade：3
Cited Count：
WoS CC Cited Count： 14
SCOPUS Cited Count：
ESI Highly Cited Papers on the List： 0 Unfold All
WanFang Cited Count：
Chinese Cited Count：
30 Days PV： 6
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