Abstract:
采用普通退火、去应力退火两种焊后热处理工艺对TC18钛合金电子束焊接接头进行焊后热处理,分别测量其接头室温拉伸和冲击性能,并对其显微组织和拉伸、冲击断口进行光学和扫描电镜观察。实验表明,随着退火温度的升高,普通退火的组织发生了再结晶和晶粒长大的过程,相比去应力退火,相含量减少,相含量增多,体现为去应力退火后的接头强度优于普通退火,接头塑性低于普通退火。
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Year: 2015
Page: 190-190
Language: Chinese
Cited Count:
WoS CC Cited Count: 0
SCOPUS Cited Count:
ESI Highly Cited Papers on the List: 0 Unfold All
WanFang Cited Count: -1
Chinese Cited Count:
30 Days PV: 16
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