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Author:

刘程艳 (刘程艳.) | 秦飞 (秦飞.) (Scholars:秦飞) | 班兆伟 (班兆伟.)

Keyword:

热传导率 塑封料 温差 缺陷检测 成像法 电子封装 检测灵敏度 试样 红外热成像 缺陷特征参数

Author Community:

  • [ 1 ] [刘程艳]北京工业大学机电学院
  • [ 2 ] [秦飞]北京工业大学机电学院
  • [ 3 ] [班兆伟]北京工业大学机电学院

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Source :

Year: 2013

Language: Chinese

Cited Count:

WoS CC Cited Count: 0

SCOPUS Cited Count:

ESI Highly Cited Papers on the List: 0 Unfold All

WanFang Cited Count: -1

Chinese Cited Count:

30 Days PV: 9

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