With　the　rapid　development　of　science　and　technology,　electronic　products　are　also　developing　towards　high　density　and　high　integration.　People　have　higher　and　higher　requirements　for　the　reliability　of　electronic　products.　The　use　environment　of　electronic　equipment　is　getting　worse　and　worse.　For　example,　in　the　process　of　aircraft　take-off,　rocket　launching,　ground　vehicles　and　warships　in　the　field　environment,　they　will　be　subjected　to　severe　vibration　impact.　Various　BGA　board-level　components　loaded　therein　also　subject　to　severe　vibration　shocks,　which　will　aggravate　the　elastic-plastic　deformation　of　solder　joints　and　invalidate　the　solder　joints　of　the　PCB　component,　thereby　preventing　the　entire　electronic　device　from　working　properly.　Therefore,　in　the　study　of　solder　joints　fatigue　reliability,　in　addition　to　the　traditional　low-cycle　thermal　fatigue　needs　to　be　considered,　the　vibration　shock　reliability　is　worthy　of　more　attention.　Different　packaging　forms　have　a　great　influence　on　the　high　cycle　fatigue　failure　of　solder　joints　and　its　fatigue　life.　This　paper　studies　the　failure　of　joints　of　Ceramic　Ball　Grid　Array　(CBGA　)　and　Plastic　Ball　Grid　Array(PBGA)　under　random　vibration　conditions,　and　the　stress　of　the　solder　joint　array　is　analyzed,　and　their　fatigue　life　under　random　vibration　conditions　is　predicted　and　compared.　According　to　the　analysis,　under　the　same　vibration　conditions,　CBGA　components　are　more　susceptible　to　vibration　deformation　than　PBGA　components,　and　are　more　likely　to　fail.