At　present,　with　the　development　of　the　electronic　packaging　industry,　the　size　of　the　packaging　is　getting　larger　and　larger,　and　the　density　of　the　interconnection　is　getting　higher　and　higher,　which　brings　great　challenges　to　the　reliability　of　the　packaged　device.　Both　the　packaging　forms　and　the　interconnection　structures　have　a　great　influence　on　the　reliability　of　the　electronic　packaging.　Column　grid　array　and　ball　grid　array　are　the　two　most　widely　used　forms　of　array　interconnects,　and　the　ceramic　packaging　and　plastic　packaging　are　the　most　widely　used　forms　of　packaging.　Therefore,　in　view　of　different　packaging　forms　and　different　interconnection　structures,　three　different　devices,　namely,　CCGA　(Ceramic　Column　Grid　Array),　CBGA　(Ceramic　Ball　Grid　Array)　and　PBGA　(Ceramic　Ball　Grid　Array),　are　used　for　temperature　cycling.　Through　comparative　analysis,　the　effects　of　packaging　forms　and　interconnection　structures　on　the　reliability　of　large-scale　packaging　in　low-temperature　thermal　fatigue　environment　were　studied,　and　life　prediction　was　carried　out.　According　to　the　analysis,　under　the　same　temperature　cycling　condition,　the　form　of　plastic　packaging　is　better　than　that　of　ceramic　packaging,　and　the　thermal　fatigue　resistance　of　the　solder　column　interconnection　structure　is　stronger　than　that　of　the　solder　ball　interconnection　structure.