Indexed by：
Abstract：
Uniform solder balls are widely used in 3D Printing and electronic packaging. Therefore, it needs a simple method for producing uniform solder balls at a higher quality. In this article, a novel and simple method was presented to produce uniform solder balls by the technology of electromagnetic force driving and differential pressure control. The results indicated that the uniform solder balls of Sn-58Bi alloy could be produced by two different modes of differential pressure control. The solder balls with a spherical degree between 0 and 3% and diameter with a mean variation of 4% were produced at different diameter and reasonable test parameters. © 2020 Elsevier B.V.
Keyword：
Reprint Author's Address：
Email：
Source ：
Materials Letters
ISSN： 0167-577X
Year： 2021
Volume： 286
3 . 0 0 0
JCR@2022
ESI Discipline： MATERIALS SCIENCE;
ESI HC Threshold：116
JCR Journal Grade：2
Cited Count：
WoS CC Cited Count： 0
SCOPUS Cited Count： 2
ESI Highly Cited Papers on the List： 0 Unfold All
WanFang Cited Count：
Chinese Cited Count：
30 Days PV： 5
Affiliated Colleges：
