The　evolution　and　strengthening　effect　of　nanoscale　precipitates　of　the　aged　Cu-Mg-Fe-Sn-P-Y　alloy　were　investigated　via　aging　treatment　in　the　400-480　degrees　C　temperature　range　and　the　10-480　min　aging　time　range.　Nanoscale　gamma-Fe　particles　uniformly　distributed　in　the　matrix　caused　dispersion　strengthening　in　the　peak-aging　stage　and　transformed　to　alpha-Fe　at　the　over-aging　stage.　The　Mg3P2　secondary　phase　hindered　the　appearance　of　coarse　Fe3P　and　formed　definite　orientation　relationship　(OR)　of　cubic　to　cubic　with　the　Cu　matrix　after　480　min　aging,　＜　110　＞(Cu)parallel　to　＜　110　＞(Mg3P2),　(002)(Cu)parallel　to(008)(Mg3P2).　The　optimal　aging　parameter　for　the　Cu-Mg-Fe-Sn-P-Y　alloy　is　60%　cold　deformation　and　aged　at　460　degrees　C　for　20　min.　The　corresponding　tensile　strength　is　599　MPa　with　the　conductivity　of　71.1%IACS　and　the　elongation　of　6.9%.　Compared　with　the　current　contact　wire,　the　ultimate　tensile　strength　and　conductivity　of　the　studied　alloy　increased　by　20%　and　15%,　respectively.　(C)　2020　The　Authors.　Published　by　Elsevier　B.V.