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Author:

Fan, Jinwei (Fan, Jinwei.) (Scholars:范晋伟) | Wang, Peitong (Wang, Peitong.) | Tao, Haohao (Tao, Haohao.) | Pan, Ri (Pan, Ri.)

Indexed by:

EI Scopus SCIE

Abstract:

Thermal deformation is the main factor of the machining accuracy for grinding machines, which seriously restricts the precision improvement of grinding machines. However, at present, there are little researches on thermal error prediction, and the accuracy of the prediction model is comparatively low. Thus, a novel approach for thermal deformation prediction of grinding machine spindle based on heat energy conduction principle and neural network is proposed in this paper. Firstly, the temperature sensors' pairs are applied to measure the temperature deviation between the spindle surface and its adjacent ambient which are directly related to the heat energy exchange. Secondly, the temperature deviations of each segment of the spindle are taken as inputs, which will exist and accumulate in the form of heat energy subsequently in the convolutional neural network. Meanwhile, the accumulated heat energy is mixed and transferred to the different segments of the spindle in the convolutional neural network. Thirdly, the thermal deformation caused by the increment of heat energy is considered as the output of thermal error prediction result based on the principle of heat energy conduction. Finally, the simulations and experiments are implemented to validate the feasibility and effectiveness of the proposed method.

Keyword:

Heat energy conduction principle Convolutional neural networks Thermal deformation prediction Grinding machine Spindle

Author Community:

  • [ 1 ] [Fan, Jinwei]Beijing Univ Technol, Beijing Key Lab Adv Mfg Technol, Beijing 100124, Peoples R China
  • [ 2 ] [Wang, Peitong]Beijing Univ Technol, Beijing Key Lab Adv Mfg Technol, Beijing 100124, Peoples R China
  • [ 3 ] [Tao, Haohao]Beijing Univ Technol, Beijing Key Lab Adv Mfg Technol, Beijing 100124, Peoples R China
  • [ 4 ] [Pan, Ri]Beijing Univ Technol, Beijing Key Lab Adv Mfg Technol, Beijing 100124, Peoples R China

Reprint Author's Address:

  • 范晋伟

    [Fan, Jinwei]Beijing Univ Technol, Beijing Key Lab Adv Mfg Technol, Beijing 100124, Peoples R China

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Source :

INTERNATIONAL JOURNAL OF ADVANCED MANUFACTURING TECHNOLOGY

ISSN: 0268-3768

Year: 2021

Issue: 3-4

Volume: 118

Page: 1125-1139

3 . 4 0 0

JCR@2022

ESI Discipline: ENGINEERING;

ESI HC Threshold:87

JCR Journal Grade:2

Cited Count:

WoS CC Cited Count: 7

SCOPUS Cited Count: 10

ESI Highly Cited Papers on the List: 0 Unfold All

WanFang Cited Count:

Chinese Cited Count:

30 Days PV: 5

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