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Author:

于稼锐 (于稼锐.) | 王剑锋 (王剑锋.) | 孙萌 (孙萌.) | 杨琎 (杨琎.) | 郭云深 (郭云深.) | 代岩伟 (代岩伟.)

Abstract:

本文制备SAC305焊层双悬臂梁(DCB)断裂试样,通过拉伸实验测得SAC305在Ⅰ型加载下的断裂下载荷位移曲线,采用弹性基础梁法计算得到能量释放率。实验研究表明,SAC焊料有着较高的断裂韧性,表明采用DCB方法研究SAC305断裂韧性的可行性。

Keyword:

SAC305 断裂韧度 能量释放率 DCB模型 Ⅰ型断裂

Author Community:

  • [ 1 ] 北京工业大学材料与制造学部电子封装技术与可靠性研究所

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Year: 2022

Language: Chinese

Cited Count:

WoS CC Cited Count: 0

SCOPUS Cited Count:

ESI Highly Cited Papers on the List: 0 Unfold All

WanFang Cited Count:

Chinese Cited Count:

30 Days PV: 56

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