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Author:

Cui, Mengya (Cui, Mengya.) | Huang, Ting (Huang, Ting.) | Xu, Jiejie (Xu, Jiejie.) | Xiao, Rongshi (Xiao, Rongshi.)

Indexed by:

EI Scopus SCIE

Abstract:

Bimodal nanoporous structure shows great potential in a wide variety of applications. So far, however, a scalable fabrication method for bimodal nanoporous structure with controllable morphology and size remains a critical challenge. Herein, we prepare a homogeneously bimodal nanoporous copper which consists of nanoslit and nanopore through combined laser processing and dealloying. The nanoslit and nanopore size can be easily altered by simply controlling the laser processing parameters. With decreased heat input during laser processing, the width of nanoslit decreases from 200 nm to 100 nm and the average size of nanopore decreases from 23.7 to 14.0 nm. The bimodal nanoporous copper is found to be principally influenced by metallurgical reaction during laser-material interaction. Compared with equilibrium-solidified as-cast alloy, phase separation and refined microstructure induced by non-equilibrium solidification through laser processing facilitates corrosion rate during dealloying and induces bimodal nanoporous structure after dealloying. © 2021 The Society of Manufacturing Engineers

Keyword:

Nanopores Dealloying Phase separation Morphology Corrosion rate

Author Community:

  • [ 1 ] [Cui, Mengya]High-Power and Ultrafast Laser Manufacturing Lab, Faculty of Materials and Manufacturing, Beijing University of Technology, China
  • [ 2 ] [Huang, Ting]High-Power and Ultrafast Laser Manufacturing Lab, Faculty of Materials and Manufacturing, Beijing University of Technology, China
  • [ 3 ] [Xu, Jiejie]High-Power and Ultrafast Laser Manufacturing Lab, Faculty of Materials and Manufacturing, Beijing University of Technology, China
  • [ 4 ] [Xiao, Rongshi]High-Power and Ultrafast Laser Manufacturing Lab, Faculty of Materials and Manufacturing, Beijing University of Technology, China

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Source :

Journal of Manufacturing Processes

ISSN: 1526-6125

Year: 2022

Volume: 73

Page: 815-821

6 . 2

JCR@2022

6 . 2 0 0

JCR@2022

ESI Discipline: ENGINEERING;

ESI HC Threshold:49

JCR Journal Grade:2

CAS Journal Grade:2

Cited Count:

WoS CC Cited Count: 0

SCOPUS Cited Count: 5

ESI Highly Cited Papers on the List: 0 Unfold All

WanFang Cited Count:

Chinese Cited Count:

30 Days PV: 8

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