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Author:

Zheng, Xiang (Zheng, Xiang.) | Feng, Shiwei (Feng, Shiwei.) (Scholars:冯士维) | Gao, Yifu (Gao, Yifu.) | Zhang, Yamin (Zhang, Yamin.) | Jia, Yunpeng (Jia, Yunpeng.) | Pan, Shijie (Pan, Shijie.)

Indexed by:

EI Scopus SCIE

Abstract:

Trapping effects in GaN HEMTs still limit their performance. The current-transient methodology has shown advantages in characterizing traps in the device. However, the voltage drift may cause errors in measurements with high accuracy requirements. In this paper, we present a methodology to characterize traps in GaN HEMTs using the voltage-transient measurements. We demonstrate the advantages of this method in terms of simplicity and effectiveness. In particular, it avoids the said problem due to the optimized measuring circuit. With this method, we have identified the time constants and energy levels of traps in the AlGaN barrier layer and the GaN buffer layer, respectively, in the devices. Their trapping and de-trapping mechanisms were also demonstrated at various temperature measurements. A classic exponential dependence of the degradation rate on the channel current was identified. © 2018 Elsevier Ltd

Keyword:

High electron mobility transistors III-V semiconductors Temperature measurement Power quality Aluminum gallium nitride Transients Semiconductor alloys Buffer layers Gallium nitride Degradation

Author Community:

  • [ 1 ] [Zheng, Xiang]College of Microelectronics, Beijing University of Technology, Beijing; 100124, China
  • [ 2 ] [Feng, Shiwei]College of Microelectronics, Beijing University of Technology, Beijing; 100124, China
  • [ 3 ] [Gao, Yifu]College of Microelectronics, Beijing University of Technology, Beijing; 100124, China
  • [ 4 ] [Zhang, Yamin]College of Microelectronics, Beijing University of Technology, Beijing; 100124, China
  • [ 5 ] [Jia, Yunpeng]College of Microelectronics, Beijing University of Technology, Beijing; 100124, China
  • [ 6 ] [Pan, Shijie]College of Microelectronics, Beijing University of Technology, Beijing; 100124, China

Reprint Author's Address:

  • 冯士维

    [feng, shiwei]college of microelectronics, beijing university of technology, beijing; 100124, china

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Source :

Microelectronics Reliability

ISSN: 0026-2714

Year: 2019

Volume: 93

Page: 57-60

1 . 6 0 0

JCR@2022

ESI Discipline: ENGINEERING;

ESI HC Threshold:136

JCR Journal Grade:3

Cited Count:

WoS CC Cited Count: 0

SCOPUS Cited Count: 13

ESI Highly Cited Papers on the List: 0 Unfold All

WanFang Cited Count:

Chinese Cited Count:

30 Days PV: 5

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