With　the　increasing　of　packaging　density　and　functional　diversity,　electronic　packaging　structures　with　multiscale　features　have　brought　huge　demand.　To　analyze　elastoplastic　problems　of　multiscale　structures　in　electronic　packaging,　this　paper　presents　an　efficient　coupling　scheme　of　Abaqus　and　a　self-written　boundary　element　method　(BEM)　code.　In　the　numerical　analysis,　based　on　the　geometric　features　of　the　multiscale　structures,　the　whole　domain　is　divided　into　two　domains:　FE　domain　and　BE　domain.　The　Abaqus　is　used　in　the　FE　domain　where　non-linear　or　nonhomogeneous　behavior　is　expected,　whereas　the　linear　elastic　domain　or　large-scale　domain　is　solved　by　the　BEM　code.　The　BE　part　in　the　whole　FE-BE　model　is　defined　as　a　super　element　(user-defined　element　in　Abaqus)　of　the　FE,　and　its　effective　stiffness　and　effective　nodal　forces　at　the　interfacial　boundary　are　evaluated　by　the　BEM　code　and　assembled　by　the　user　subroutine　(UEL)　into　the　FE　system.　Users　not　only　benefit　from　the　powerful　functions　of　Abaqus,　but　also　can　use　BEM　as　a　complement　to　improve　solution　accuracy.　The　numerical　example　shows　that　the　stress　results　obtained　by　the　scheme　are　in　a　great　agreement　with　the　results　obtained　by　a　detailed　finite　element　model.　　©　2022　IEEE.