Dynamic　loading　is　a　critical　factor　influencing　the　reliability　of　electronic　packaging,　necessitating　the　development　of　efficient　and　accurate　numerical　methods　tailored　for　studying　electronic　packaging　reliability.　This　paper　presents　a　coupled　finite　element–boundary　element　approach　suitable　for　analyzing　transient　elastic　dynamic　response　problems　in　electronic　packaging　structures.　The　core　concept　involves　integrating　the　boundary　element　method　into　the　finite　element　framework,　thereby　reducing　the　number　of　elements　required　for　the　finite　element　analysis　of　intricate　electronic　packaging　geometries.　Additionally,　to　leverage　the　powerful　pre-processing　and　post-processing　capabilities　offered　by　commercial　finite　element　software,　the　boundary　element　method　is　integrated　into　Abaqus,　forming　a　finite　element–boundary　element　coupling　algorithm　within　this　platform.　In　the　numerical　analysis　process,　the　structure　under　investigation　is　first　partitioned　into　finite　element　and　boundary　element　domains　according　to　its　geometric　characteristics　and　material　properties.　These　distinct　domains　are　then　modeled　separately　within　Abaqus,　where　material　properties　and　element　types　are　assigned.　Compared　to　traditional　numerical　analysis　methodologies　for　electronic　packaging　structures,　this　coupled　algorithm　fully　capitalizes　on　the　robust　pre-processing　and　secondary　development　capabilities　of　Abaqus,　effectively　combining　the　advantages　of　both　the　finite　element　and　boundary　element　methods　while　reducing　the　number　of　elements　required　in　the　finite　element　analysis.　Numerical　examples　demonstrate　the　efficacy　of　this　coupled　algorithm　in　analyzing　dynamic　problems　prevalent　in　electronic　packaging　structures.　©　2024　Elsevier　Ltd