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Author:

Liu, Kun (Liu, Kun.) | Yan, Zhaoyang (Yan, Zhaoyang.) | Pan, Rui (Pan, Rui.) | Wang, Fude (Wang, Fude.) | Chen, Shujun (Chen, Shujun.)

Indexed by:

EI Scopus SCIE

Abstract:

Interfacial bonding reliability is a critical issue in bimetallic structures. To understand the effect of deposition sequence on interfacial characteristics, bimetallic structures of Inconel and copper alloys were fabricated by directed energy deposition arc (DED-Arc). The interfacial element diffusion behaviors and formation mechanisms were investigated in detail. The bimetallic structure of C18150 on GH4169 exhibits a sound metallurgical bonding interface with a wide interfacial region (similar to 400 mu m), which is attributed to Marangoni convection and intense elemental interdiffusion. The study highlights the feasibility of fabricating large Inconel-copper functional bimetallic structures with sound metallurgical bonding using DED-Arc and it provides a theoretical reference for design and fabrication of bimetallic structures with material-property mismatches.

Keyword:

Bimetallic structures Directed energy deposition-Arc Interfacial characteristics Additive manufacturing

Author Community:

  • [ 1 ] [Liu, Kun]Beijing Univ Technol, Fac Mat & Mfg, Beijing 100124, Peoples R China
  • [ 2 ] [Yan, Zhaoyang]Beijing Univ Technol, Fac Mat & Mfg, Beijing 100124, Peoples R China
  • [ 3 ] [Pan, Rui]Beijing Univ Technol, Fac Mat & Mfg, Beijing 100124, Peoples R China
  • [ 4 ] [Chen, Shujun]Beijing Univ Technol, Fac Mat & Mfg, Beijing 100124, Peoples R China
  • [ 5 ] [Wang, Fude]Capital Aerosp Machinery Corp Ltd, Beijing 100076, Peoples R China

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Source :

MATERIALS LETTERS

ISSN: 0167-577X

Year: 2023

Volume: 345

3 . 0 0 0

JCR@2022

ESI Discipline: MATERIALS SCIENCE;

ESI HC Threshold:26

Cited Count:

WoS CC Cited Count: 5

SCOPUS Cited Count: 5

ESI Highly Cited Papers on the List: 0 Unfold All

WanFang Cited Count:

Chinese Cited Count:

30 Days PV: 5

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