In　recent　years,　glass　interposer　has　emerged　as　a　superior　alternative　to　organic　and　silicon-based　interposers　for　advanced　2.5D　or　3D　IC,　due　to　its　attractive　advantages　such　as　excellent　electrical　isolation,　better　radio　frequency　performance,　better　feasibility　with　the　CTE　and　could　be　fabricated　with　large　size.　However,　the　warpage　for　wafer　level　2.5D　or　3D　packaging　using　glass　interposer　is　a　serious　issue.　In　this　paper,　A　new　type　of　3D　wafer　level　packaging　for　MEMS　based　on　glass　interposer　is　presented　and　the　warpage　during　the　molding　process　is　investigated　based　on　finite　element　simulation.　The　effect　of　different　material　parameters　and　thickness　of　glass　on　warpage　characteristics　is　investigated.　The　results　show　that　when　the　CTE　increases　from　3　ppm/°C　to　10　ppm/°C　for　glass　interposer,　the　wafer　warpage　variation　from　＇smile＇　to　＇cry＇.　Our　experiments　indicated　that　the　optimized　glass　interposer　successfully　passed　the　reliability　test　of　precondition　level　3.　It　is　a　conclusion　that　the　process　flow　of　the　glass　interposer　and　FEM　simulation　process　offers　a　significant　reference　for　3D　product　applications.　Moreover,　in　the　next　step,　we　will　discuss　how　to　modify　the　material　parameters　and　thickness　of　the　EMC　to　improve　the　performance　of　the　glass　interposer.　©　2021　IEEE.