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Author:

Zhan, Fangyuan (Zhan, Fangyuan.) | Li, Zhiwei (Li, Zhiwei.) | Zhang, Zhengfeng (Zhang, Zhengfeng.) | Guo, Dengzhu (Guo, Dengzhu.) | Zhang, Gengmin (Zhang, Gengmin.) | Yan, Pengfei (Yan, Pengfei.) | Wei, Xianlong (Wei, Xianlong.)

Indexed by:

EI Scopus SCIE

Abstract:

Vacuum sensors with small footprint, high sensitivity and wide detection range are important for the vacuum measurements in small space. Here, we report a new on-chip nanoscale vacuum sensor (NVS) based on electroformed silicon oxide with the structure of a nanoscale gap between two graphene electrodes on SiO2 substrate. The electrical resistance of the NVS increases exponentially by a magnitude of two orders with air pressure increasing from similar to 10(-1) Pa to similar to 10(4) Pa. The increase of O-2 partial pressure is responsible for the resistance increase of electroformed silicon oxide, where a Si-SiOx-Si tunneling diode is formed. The advantages of nanoscale size, simple structure, high sensitivity, direct electrical readout and wide detection range make the NVS promising for vacuum measurement of microscale space.

Keyword:

tunneling diode Nanoscale vacuum sensor vacuum measurement electroformed silicon oxide

Author Community:

  • [ 1 ] [Zhan, Fangyuan]Peking Univ, Sch Elect, Key Lab Phys & Chem Nanodevices, Beijing 100871, Peoples R China
  • [ 2 ] [Li, Zhiwei]Peking Univ, Sch Elect, Key Lab Phys & Chem Nanodevices, Beijing 100871, Peoples R China
  • [ 3 ] [Guo, Dengzhu]Peking Univ, Sch Elect, Key Lab Phys & Chem Nanodevices, Beijing 100871, Peoples R China
  • [ 4 ] [Zhang, Gengmin]Peking Univ, Sch Elect, Key Lab Phys & Chem Nanodevices, Beijing 100871, Peoples R China
  • [ 5 ] [Wei, Xianlong]Peking Univ, Sch Elect, Key Lab Phys & Chem Nanodevices, Beijing 100871, Peoples R China
  • [ 6 ] [Zhang, Zhengfeng]Beijing Univ Technol, Fac Mat & Mfg, Beijing Key Lab Microstruct & Property Solids, Beijing 410082, Peoples R China
  • [ 7 ] [Yan, Pengfei]Beijing Univ Technol, Fac Mat & Mfg, Beijing Key Lab Microstruct & Property Solids, Beijing 410082, Peoples R China

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Source :

IEEE ELECTRON DEVICE LETTERS

ISSN: 0741-3106

Year: 2023

Issue: 10

Volume: 44

Page: 1760-1763

4 . 9 0 0

JCR@2022

Cited Count:

WoS CC Cited Count:

SCOPUS Cited Count:

ESI Highly Cited Papers on the List: 0 Unfold All

WanFang Cited Count:

Chinese Cited Count:

30 Days PV: 0

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