Improved Thermal Conductivity and Reliability Through Graphene Reinforced Nanopaste for Power Devices in New Energy Vehicles - Details

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Ag　nanopaste　is　one　of　the　most　promising　die-attach　materials　in　power　devices.　In　this　work,　robust　sintered　SiC　devices　are　achieved　by　using　graphene　reinforced　Ag　nanopaste　to　improve　the　heat　dissipation　and　shear　strength.　Microstructure,　mechanical,　and　electrical　properties　of　the　sintered　joints　are　investigated.　The　addition　graphene　can　bring　exciting　performance　improvements,　and　graphene　(　©　2011-2012　IEEE.

Keyword：

Silicon carbide Thermal conductivity Reinforcement Graphene Substrates Silver Temperature Sintering

Author Community：

[ 1 ] [Zhang, Hongqiang]Beihang University, School of Mechanical Engineering and Automation, Beijing; 100191, China
[ 2 ] [He, Siliang]Guilin University of Electronic Technology, Guangxi Key Laboratory of Manufacturing System and Advanced Manufacturing Technology, School of Mechanical and Electrical Engineering, Guilin; 541004, China
[ 3 ] [Qu, Guanda]Beihang University, School of Mechanical Engineering and Automation, Beijing; 100191, China
[ 4 ] [Deng, Zhongyang]Tsinghua University, Department of Mechanical Engineering, Beijing; 100084, China
[ 5 ] [Zou, Guisheng]Tsinghua University, Department of Mechanical Engineering, Beijing; 100084, China
[ 6 ] [Jia, Qiang]Beijing University of Technology, Faculty of Materials and Manufacturing, Beijing; 100124, China
[ 7 ] [Deng, Erping]North China Electric Power University, State Key Laboratory of Alternate Electrical Power System with Renewable Energy Sources, Beijing; 102206, China
[ 8 ] [Guo, Wei]Beihang University, School of Mechanical Engineering and Automation, Beijing; 100191, China

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2022，IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY

Source ：

IEEE Transactions on Components, Packaging and Manufacturing Technology

ISSN： 2156-3950

Year： 2024

Issue： 1

Volume： 14

Page： 52-60

2 . 2 0 0

JCR@2022

Cited Count：

WoS CC Cited Count： 0

SCOPUS Cited Count： 13

ESI Highly Cited Papers on the List： 0 Unfold All

WanFang Cited Count：

Chinese Cited Count：

30 Days PV： 8

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