The　high-speed　development　of　5G　technology　and　electronic　components　has　provided　an　opportunity　for　micro　heat　pipe　arrays　(MHPAs).　This　study　proposes　a　grooved　multi-hole　wick　structure　heat　pipe　(MHPA-CFW)　with　an　MHPA　micro-fin　structure　injected　with　copper　foam　to　enhance　the　heat　transfer　performance.　The　study　investigates　how　the　heat　transfer　capability　of　MHPA-CFW　is　affected　by　the　pore　density　and　width　of　copper　foam.　It　also　examines　its　ability　to　function　against　gravity　at　various　working　inclinations.　Experimental　findings　demonstrate　that　the　MHPA-CFW　exhibits　superior　heat　transfer　capability　compared　with　that　of　MHPA.　Under　vertical　operation,　the　heat　transfer　capability　increases　as　the　pore　density　rises　at　the　low　heat　flux.　However,　it　initially　improves　and　then　weakens　with　an　increase　in　the　pore　density　when　the　heat　flux　exceeds　3.75　W/cm2.　2　.　The　heat　transfer　capability　deteriorates　as　the　copper　foam　width　increases.　A　4#MHPACFW　(95PPI,　1.0　mm)　was　chosen　for　the　multi-orientation　experiment.　Results　indicate　that　it　significantly　enhances　the　heat　transfer　capability　by　overcoming　the　effects　of　gravity　when　the　working　inclination　angle　changes　from　90　degrees　degrees　to-　10　degrees.　degrees　.　These　results　provide　a　reference　for　improving　heat　transfer　and　expanding　heat　pipe　applications　in　electronic　heat　dissipation.