To　investigate　the　method　to　enhance　the　heat　transfer　performance　of　a　micro　heat　pipe　array,　two　types　of　copper　foam　with　different　pore-diameters　and　porosities　were　added　inside　the　micro　heat　pipe　array　with　rectangular　micro-fins,　respectively,　to　form　a　composite　wick　inside　the　micro　heat　pipe　array.　An　experimental　investigation　was　conducted　to　explore　the　relationship　between　the　thermal　resistance　and　heating　power　of　the　copper　foam　micro　heat　pipe　array　across　various　ambient　temperatures.　It　was　found　that　the　addition　of　copper　foam　obviously　improves　the　capillary　force　of　the　wick　and　reduce　the　thermal　resistance　from　0.635　K/W　to　0.445　K/W　and　0.394　K/W,　which　were　29.9　%　and　38.0　%,　respectively,　at　the　heating　power　of　about　18　W.　The　impact　of　the　ambient　temperature　on　the　thermal　resistance　of　the　copper　foam　micro　heat　pipe　array　depends　on　the　geometry　of　the　copper　foam.　The　study　provides　a　data　base　for　the　enhanced　heat　transfer　mechanism　of　a　micro　heat　pipe　array　by　composite　wicks,　and　acts　as　a　reference　for　methods　to　improve　the　performance　of　micro　heat　pipe　arrays.