A　double　L-shaped　heat　pipe　sink　that　uses　a　micro　heat　pipe　array　is　proposed　for　heat　dissipation　and　temperature　uniformity　in　high-power　electronics　chip　cooling　for　the　first　time　in　this　work.　The　radiator　is　composed　of　two　L-shaped　micro　heat　pipe　arrays　filled　with　copper　foam　wick　(the　composite　wick　structure)　and　aluminum　flat　fins,　which　can　reduce　the　temperature　of　hotspots　of　electronics　effectively　and　has　good　inclination　adaptability.　Through　experiments,　the　heat　transfer　performance　is　studied　under　different　copper　foam　filling　lengths,　liquid　filling　rates,　and　inclination　angles.　Then,　a　numerical　simulation　of　the　effect　of　different　fin　parameters　on　the　radiator　is　conducted　using　Icepak.　The　composite　wick　structure　effectively　enhances　the　heat　transfer　capability　of　the　radiator.　Results　show　that　the　average　thermal　resistance　of　the　micro　heat　pipe　array　with　a　composite　wick　structure　is　0.258　K/W,　indicating　a　23　%　reduction　compared　with　that　of　a　single　wick　structure　double　L　shape　heat　pipe　sink.　The　double　L　shape　heat　pipe　sink　solves　the　phenomenon　of　chip　temperature　jump　caused　by　the　hotspots　of　high　heat　flux.　The　average　temperature　of　the　chip　surface　can　be　controlled　below　62　degrees　C　when　the　localized　heat　flux　is　200　W/cm2.　Simulation　results　show　that　optimization　of　the　fin　structure　can　stabilize　the　temperature　of　the　214　W　chip　at　70.1　degrees　C,　which　is　reduced　by　8.7　%　than　before　optimization.