The　high　heat　transfer　coefficient　and　critical　heat　flux　density　of　thin　liquid　film　boiling　provide　new　ideas　for　enhancing　boiling　heat　transfer,　but　the　bottom-up　liquid　supply　method　limits　its　further　application　and　development.　This　study　is　based　on　the　experimental　research　results　of　previous　researchers　and　adds　lateral　liquid　supply　while　maintaining　a　lower　liquid　level.　And　thin　liquid　film　boiling　experiments　were　conducted　on　the　surface　of　silicon　under　low　subcooling　conditions　(subcooling　degree:　5　K).　The　obtained　curves　were　compared　with　the　results　of　smooth　copper　surface　in　pool　boiling　experiments.　Among　them,　thin　liquid　film　boiling　exhibits　excellent　HTC　and　higher　CHF　(12.26　W/cm2　&　sdot;K　and　191.63　W/cm2,　respectively).　Then,　the　bubble　behavior　and　flow　characteristics　of　thin　liquid　film　boiling　bubbles　were　visualized　and　the　heat　transfer　mechanism　was　analyzed.　The　experimental　results　indicate　that　the　lateral　liquid　supply　boiling　structure　designed　in　this　study　has　great　potential　for　application.