Electronic　equipment　generates　heat　during　prolonged　operation,　making　efficient　heat　dissipation　essential　to　ensure　continuous　functionality　and　prevent　premature　device　failure.　Accordingly,　phase　change　materials　(PCMs)　were　employed　for　thermal　management;　however,　their　low　thermal　conductivity　limits　their　effectiveness　in　temperature-sensitive　electronic　systems.　PCMs　can　be　made　more　thermally　conductive　with　the　use　of　nanocarriers-based　phase　change　materials　(NcPCMs),　which　could　lower　system　temperatures　and　increase　device　operational　lifetimes.　In　this　study,　the　main　objective　is　to　improve　overall　performance　of　heat　sinks　by　integrating　ZnO　nanocarriers　into　RT54HC　(PCM)　to　enhance　thermal　conductivity　using　ZnO/RT54HC　(NcPCM)　across　various　transient　heat　energy　loads　(09　W–27　W)　and　different　optimal　saturation　levels　of　ZnO,　varying　between　1.0　wt%　to　3.0　wt%.　Simple　and　copper　foam　embedded　heat　sinks　demonstrated　significant　temperature　reduction　by　incorporating　ZnO　into　cooling　media　within　the　internal　cavities　in　contrast　to　the　unfilled,　unfinned　heat　sink　under　all　heat　inputs.　These　findings　showed　the　effectiveness　of　NcPCM　based　copper　sink　in　reducing　peak　temperature　of　24.02　%　and　improving　operational　time　of　35　and　69　min　at　targeted　critical　temperatures　of　50　°C　and　60　°C　owing　to　favorable　characteristics　of　high　thermal　conductivity　and　increased　surface　area.　Hence,　the　incorporation　of　nanocarriers　into　nontoxic　environment　friendly　PCMs　is　strongly　advocated　to　promote　sustainable　progress　in　electronic　thermal　management,　as　it　offers　clean,　zero-emission　energy　storage　solution.　©　2025　The　Authors