Phase　change　materials　(PCMs),　as　a　thermal　storage　unit,　have　been　used　in　thermal　management　area　for　integrated　circuits　(ICs).　However,　the　heat　dissipation　from　the　chip　to　PCM-based　heat　sink　needs　much　long　time　which　greatly　suppresses　cooling　effect　of　PCMs.　In　this　paper,　a　new　package　frame　with　PCM　directly　touching　top　of　the　chips　inside　the　package　cavity　instead　of　using　PCM-based　heat　sink　is　proposed　to　accelerate　this　heat　dissipation　process.　The　proposed　model　is　verified　by　carrying　out　simulations　and　experiments.　To　obtain　more　precise　experimental　results,　the　extra　tiny　thermocouple　and　chip-level　heat　generators　are　utilized.　The　results　show　2°C-5°C　temperature　reductions　under　300　mW-800　mW　input　which　proves　the　effectiveness　of　the　proposed　approach.　What＇s　more,　this　method　can　be　easily　combined　with　other　thermal　management　methods　to　further　alleviate　the　thermal　problem　of　the　chips.　©　2017　IEEE.