Nowadays,　the　growing　number　of　electronic　components　in　integrated　circuit(IC)　chips　require　higher　cooling　efficiency.　Here　we　propose　a　universal　efficient　cooling　structure　based　on　Micro-Channel　Heat　Sink　(MCHS),　which　can　be　applied　to　heat　dissipation　of　IC　chips　with　uniform　and　non-uniform　heat　fluxes.　When　using　GFSMs　(Gradually-Higher　Fins　Spilt-Flow　Microstructures)　MCHS　to　cool　an　IC　chip　with　a　uniform　heat　flux　of　100　W/cm2,　the　thermal　resistance　and　MATD　(mean　absolute　temperature　difference)　of　regular　MCHS　can　be　reduced　by　57%　and　77%.　At　the　same　time,　the　GFSMs　MCHS　can　reduce　the　thermal　resistance　to　less　than　0.28　K/W　with　only　1/4　of　the　pressure　drop　of　the　regular　MCHS,　and　the　thermal　resistance　can　be　reduced　to　below　0.15　K/W　with　a　pump　power　of　0.04　W.　In　addition,　TTSV　(Thermal　Through　Silicon　Via)　is　combined　with　a　split-flow　microstructure　to　form　a　three-dimensional　heat　dissipation　structure　(3D-HDS).　When　using　3D-HDS　MCHS　to　cool　a　chip　containing　a　1250　W/cm2　heat　flux　hotspot,　simulations　show　that　the　thermal　resistance　and　MATD　decreased　by　more　than　40%　compared　to　regular　MCHS.　The　cooling　structure　will　have　broad　application　prospects　in　the　field　of　high-power　integrated　circuits　and　electronic　cooling.　©　2022　Elsevier　Ltd