Aiming　at　the　uneven　heat　dissipation　induced　by　the　uneven　water　channel　flow　of　microchannel-heat　sink　for　original　curamik,　the　numerical　simulation　based　on　FLUENT　software　is　carried　out.　Optimization　scheme　is　proposed　from　the　aspect　of　internal　structure　and　the　heat　sink　material.　The　influence　of　the　microchannel　width,　interval　and　microchannel　ridge　length　on　the　chip　surface　temperature　rise　and　pressure　drop　are　obtained,　when　the　heat　sink　height　and　the　width　of　the　import　and　export　are　invariant.　Based　on　the　optimized　parameters,　the　pure　Ni　microchannel　heat　sink　is　manufactured　by　selective　laser　melting　technology,　and　the　chip　is　packaged　and　tested.　The　results　show　that　thermal　resistance　of　microchannel　heat　sink　reaches　0.39　K/W,　the　pressure　drop　reaches　140　kPa,　which　can　meet　the　need　of　80　W　semiconductor　laser　cooling　requirements.　©　2017,　Chinese　Lasers　Press.　All　right　reserved.