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Author:

Zhao, Z. (Zhao, Z..) | Yao, X. (Yao, X..) | Hou, C. (Hou, C..) | Han, T. (Han, T..) | Yang, E. (Yang, E..) | Zheng, X. (Zheng, X..) | Li, X. (Li, X..) | Song, X. (Song, X..)

Indexed by:

EI Scopus SCIE

Abstract:

Conventional fabrication methods for W[sbnd]Cu composites possess several limitations on the ultimate densification and comprehensive performance of products. Here we propose an innovative protocol to prepare W[sbnd]Cu via photochemical reactions at ambient conditions. Specifically engineered polymeric reagent guided the continuous growth of Cu within W matrix and enhanced the affinity among W/Cu phases, whose combination led to well densified W[sbnd]Cu composite. Our strategy completely avoided thermally induced grain growth and flipped the immiscible nature of W/Cu interfaces. It was even possible to simultaneously fabricate and shape products using patterned light field. This strategy provides new insight on fabricating metallic composites. © 2025 Elsevier Ltd

Keyword:

Photochemistry Wettability Tungsten‑copper composite Rational molecular design Polymer-assisted metal deposition

Author Community:

  • [ 1 ] [Zhao Z.]Key Laboratory of Advanced Functional Materials, Education Ministry of China, College of Material Science and Engineering, Beijing University of Technology, Beijing, 100124, China
  • [ 2 ] [Yao X.]Key Laboratory of Advanced Functional Materials, Education Ministry of China, College of Material Science and Engineering, Beijing University of Technology, Beijing, 100124, China
  • [ 3 ] [Hou C.]Key Laboratory of Advanced Functional Materials, Education Ministry of China, College of Material Science and Engineering, Beijing University of Technology, Beijing, 100124, China
  • [ 4 ] [Han T.]Key Laboratory of Advanced Functional Materials, Education Ministry of China, College of Material Science and Engineering, Beijing University of Technology, Beijing, 100124, China
  • [ 5 ] [Yang E.]Key Laboratory of Advanced Functional Materials, Education Ministry of China, College of Material Science and Engineering, Beijing University of Technology, Beijing, 100124, China
  • [ 6 ] [Zheng X.]Key Laboratory of Advanced Functional Materials, Education Ministry of China, College of Material Science and Engineering, Beijing University of Technology, Beijing, 100124, China
  • [ 7 ] [Li X.]Key Laboratory of Advanced Functional Materials, Education Ministry of China, College of Material Science and Engineering, Beijing University of Technology, Beijing, 100124, China
  • [ 8 ] [Song X.]Key Laboratory of Advanced Functional Materials, Education Ministry of China, College of Material Science and Engineering, Beijing University of Technology, Beijing, 100124, China

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Source :

International Journal of Refractory Metals and Hard Materials

ISSN: 0263-4368

Year: 2025

Volume: 128

3 . 6 0 0

JCR@2022

Cited Count:

WoS CC Cited Count:

SCOPUS Cited Count:

ESI Highly Cited Papers on the List: 0 Unfold All

WanFang Cited Count:

Chinese Cited Count:

30 Days PV: 6

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