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Author:

Zhu, Kongyang (Zhu, Kongyang.) | Zhang, Shurui (Zhang, Shurui.) | Li, Peng (Li, Peng.) | He, Cunfu (He, Cunfu.) | Liu, Xiucheng (Liu, Xiucheng.)

Indexed by:

EI Scopus SCIE

Abstract:

Due to the spatial resolution limitation of the magnetic Barkhausen Noise (MBN) sensor, the mechanism by which MBN signals are affected by the elastoplastic evolution process at the grain scale remains unclear. In this study, a high-resolution MBN sensor was used to investigate the distribution of MBN signals near grain boundary in grain-oriented silicon steel under controlled residual plastic strain and applied stress, simulating a cold work hardening process. It was observed that MBN signals near the grain boundary varied with the introduction of applied stress and residual plastic strain. A multi-factor mechanism was analyzed and proposed, incorporating the effects of microstructure, applied stress/strain, and residual stress at the grain scale. These findings provide valuable insights for the subsequent improvement of the micromagnetic theory at the grain scale.

Keyword:

applied stress residual stress residual plastic strain grain boundary high-resolution sensor magnetic Barkhausen noise

Author Community:

  • [ 1 ] [Zhu, Kongyang]Beijing Univ Technol, Coll Mech & Energy Engn, Beijing 100124, Peoples R China
  • [ 2 ] [Zhang, Shurui]Beijing Univ Technol, Sch Informat Sci & Technol, Beijing 100124, Peoples R China
  • [ 3 ] [Li, Peng]Beijing Univ Technol, Sch Informat Sci & Technol, Beijing 100124, Peoples R China
  • [ 4 ] [He, Cunfu]Beijing Univ Technol, Sch Informat Sci & Technol, Beijing 100124, Peoples R China
  • [ 5 ] [Liu, Xiucheng]Beijing Univ Technol, Sch Informat Sci & Technol, Beijing 100124, Peoples R China

Reprint Author's Address:

  • [Zhang, Shurui]Beijing Univ Technol, Sch Informat Sci & Technol, Beijing 100124, Peoples R China;;[Li, Peng]Beijing Univ Technol, Sch Informat Sci & Technol, Beijing 100124, Peoples R China

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Source :

MEASUREMENT SCIENCE AND TECHNOLOGY

ISSN: 0957-0233

Year: 2025

Issue: 3

Volume: 36

2 . 4 0 0

JCR@2022

Cited Count:

WoS CC Cited Count:

SCOPUS Cited Count:

ESI Highly Cited Papers on the List: 0 Unfold All

WanFang Cited Count:

Chinese Cited Count:

30 Days PV: 6

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